品牌是'Microchip' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 材料 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | 容差 | JESD-609代码 | 无铅代码 | 零件状态 | 终止次数 | ECCN 代码 | 温度系数 | 类型 | 电阻 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 组成 | 附加功能 | HTS代码 | 子类别 | 额定功率 | 最大功率耗散 | 技术 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 频率 | 基本部件号 | 军用标准 | JESD-30代码 | 资历状况 | 失败率 | 电源 | 温度等级 | 界面 | 内存大小 | 工作电源电流 | 操作模式 | 时钟频率 | 电源电流-最大值 | 输入类型 | 电流源 | 访问时间 | 内存格式 | 内存接口 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 写入周期时间 - 字符、页面 | 地址总线宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 最高频率 | 筛选水平 | 并行/串行 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 数据保持时间 | 写入保护 | 备用内存宽度 | 数据轮询 | 电压 - 供电 (最大值) | 电压 - 供电 (最小值) | 页面尺寸 | I2C控制字节 | 特征 | 反向引脚排列 | 计数 | 组织的记忆 | 直径 | 长度 | 宽度 | 辐射硬化 | 无铅 | ||||||||||||||||||||||||||||||||||||
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![]() | 93AA86AT-I/OTG | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 6 | 6 | 2048 words | 2000 | 85 °C | -40 °C | PLASTIC/EPOXY | LSSOP | TSOP5/6,.11,37 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | 2.5 V | 40 | 93AA86AT-I/OTG | 有 | 不推荐 | MICROCHIP TECHNOLOGY INC | SOT-23 | LSSOP, TSOP5/6,.11,37 | 5.16 | 1 MHz | 1 | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 0.95 mm | compliant | R-PDSO-G6 | 不合格 | 2/5 V | INDUSTRIAL | SYNCHRONOUS | 0.003 mA | 2KX8 | 1.45 mm | 8 | 0.000001 A | 16384 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 5 ms | 200 | SOFTWARE | 5.5 V | 1.8 V | 2.9 mm | 1.55 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 93LC66C-I/SNG | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 8 | 85 °C | 有 | 93LC66C-I/SNG | 3 MHz | 256 words | 2.5 V | SOP | RECTANGULAR | Microchip Technology Inc | 不推荐 | MICROCHIP TECHNOLOGY INC | 5.15 | SOIC | SOP, SOP8,.25 | 小概要 | 1 | 256 | PLASTIC/EPOXY | SOP8,.25 | -40 °C | 40 | e3 | 有 | EAR99 | Matte Tin (Sn) | ALSO CONFIGURABLE AS 512 X 8 | 8542.32.00.51 | EEPROMs | CMOS | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | R-PDSO-G8 | 不合格 | 3/5 V | INDUSTRIAL | SYNCHRONOUS | 0.002 mA | 256X16 | 1.75 mm | 16 | 0.000001 A | 4096 bit | SERIAL | EEPROM | MICROWIRE | 1000000 Write/Erase Cycles | 6 ms | 200 | SOFTWARE | 8 | 5.5 V | 1.8 V | 4.9 mm | 3.9 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24CS256T-I/Q4B | Microchip Technology | 数据表 | 20000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | UDFN-8 | 8-UDFN (2x3) | 微芯片技术 | Details | SMD/SMT | I2C | 1.7 V | - 40 C | + 85 C | 3.4 MHz | 200 Year | 1 mA | 5000 | Tape & Reel (TR) | 活跃 | Non-Volatile | 5.5 V | -40°C ~ 85°C (TA) | Reel | - | EEPROM | 1.7 V to 5.5 V | 256 kbit | 3 uA | 3.4 MHz | 70 ns | EEPROM | I²C | 32 k x 8 | 5ms | 32K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT24C02BU3-UU-T | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Lead, Tin | 通孔 | YES | 8 | 8 | 2.5 V | 256 words | 0.4 MHz | AT24C02BU3-UU-T | 有 | RECTANGULAR | Atmel Corporation | Obsolete | ATMEL CORP | Non-Compliant | 85 °C | -40 °C | BGA8,2X4,40/20 | PLASTIC/EPOXY | 256 | 8.35 | BGA | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | VFBGA, BGA8,2X4,40/20 | VFBGA | Tape & Reel (TR) | 1 % | 2 | EAR99 | 25 ppm/°C | 442 kΩ | 175 °C | -65 °C | Metal Film | 8542.32.00.51 | EEPROMs | 100 mW | 100 mW | CMOS | BOTTOM | BALL | 1 | 0.5 mm | unknown | MIL-PRF-55182 | R-PBGA-B8 | 不合格 | 0.001 % | 2/5 V | INDUSTRIAL | SYNCHRONOUS | 0.003 mA | 256X8 | 0.91 mm | 8 | 0.000003 A | 2048 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 100 | HARDWARE | 5.5 V | 1.8 V | 1010DDDR | Military, Moisture Resistant, Weldable | 1.78 mm | 3.81 mm | 1.78 mm | 无 | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | WF2M32I-150HM5 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 6-CLCC | 66 | 6-CLCC (7x5) | Non-Compliant | NOR | -40°C ~ 85°C | Tape & Reel (TR) | FemtoClock® NG | 活跃 | VCXO | 125 °C | -55 °C | 3.135 V ~ 3.465 V | 231.25MHz | IDT8N3SV76KC | Parallel | 130mA | 21 b | 64 Mb | -- | 无 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AT34C02D-CUM-T | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | YES | Cast Iron | 8 | 256 words | 0.4 MHz | 有 | 85 °C | 未说明 | -40 °C | PLASTIC/EPOXY | Grove Gear | NH-HMQ813-30-H1-56-10 | 1.50 X 2 MM, 0.50 MM PITCH, GREEN, VFBGA-8 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 256 | 5.64 | MICROCHIP TECHNOLOGY INC | 活跃 | RECTANGULAR | VFBGA | 3 V | EAR99 | 8542.32.00.51 | CMOS | BOTTOM | BALL | 未说明 | 1 | 0.5 mm | compliant | R-PBGA-B8 | INDUSTRIAL | SYNCHRONOUS | C-Face Quilled | 256X8 | 0.85 mm | 8 | 2048 bit | SERIAL | EEPROM | I2C | 5 ms | 5.5 V | 1.7 V | 2 mm | 1.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24LC32AF-I/MNY | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 8 | 4000 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 5 V | 40 | 24LC32AF-I/MNY | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | DFN | HVSON, | 5.34 | 0.4 MHz | 1 | 4096 words | e4 | 有 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.51 | DUAL | 无铅 | 260 | 1 | 0.5 mm | compliant | R-PDSO-N8 | 不合格 | INDUSTRIAL | SYNCHRONOUS | 4KX8 | 0.8 mm | 8 | 32768 bit | SERIAL | EEPROM | I2C | 5 ms | 5.5 V | 2.5 V | 3 mm | 2 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24LC16BH-E/MNY | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 8 | 125 °C | -40 °C | PLASTIC/EPOXY | HVSON | SOLCC8,.11,20 | RECTANGULAR | 小概要 | 2.5 V | Compliant | 24LC16BH-E/MNY | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | DFN | 2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8 | 5.12 | 0.4 MHz | 256 words | 256 | EAR99 | 125 °C | -40 °C | 8542.32.00.51 | 5 V | DUAL | 无铅 | 1 | 0.5 mm | compliant | R-PDSO-N8 | 不合格 | 3/5 V | AUTOMOTIVE | I2C, Serial | 2 kB | SYNCHRONOUS | 0.003 mA | 900 ns | 256X8 | 0.8 mm | 8 | 16 kb | 0.000005 A | 2048 bit | 400 kHz | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 5.5 V | 1.7 V | 1010MMMR | 3 mm | 2 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24LC04BH-I/MNY | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 8 | -40 °C | PLASTIC/EPOXY | HVSON | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | Automotive grade | 24LC04BH-I/MNY | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | DFN | HVSON, SOLCC8,.11,20 | 5.35 | 0.4 MHz | 256 words | 256 | 85 °C | e4 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.51 | DUAL | 无铅 | 1 | 0.5 mm | compliant | R-PDSO-N8 | 不合格 | 3/5 V | INDUSTRIAL | SYNCHRONOUS | 0.003 mA | 256X8 | OPEN-DRAIN | 0.8 mm | 8 | 0.000005 A | 4096 bit | ISO/TS-16949 | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | YES | 5.5 V | 2.5 V | 16 words | 1010XXMR | NO | 3 mm | 2 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24LC64F-I/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 8 | 8000 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 5 V | 40 | 24LC64F-I/MNY | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | DFN | HVSON, | 5.36 | 0.4 MHz | 1 | 8192 words | e4 | 有 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.51 | DUAL | 无铅 | 260 | 1 | 0.5 mm | compliant | R-PDSO-N8 | 不合格 | INDUSTRIAL | SYNCHRONOUS | 8KX8 | 0.8 mm | 8 | 65536 bit | SERIAL | EEPROM | I2C | 5 ms | 5.5 V | 2.5 V | 2 mm | 3 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24AA64F-I/MNY | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 8 | 8000 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 5 V | 40 | 24AA64F-I/MNY | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | DFN | HVSON, | 5.5 | 0.4 MHz | 1 | 8192 words | e4 | 有 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.51 | DUAL | 无铅 | 260 | 1 | 0.5 mm | compliant | R-PDSO-N8 | 不合格 | INDUSTRIAL | SYNCHRONOUS | 8KX8 | 0.8 mm | 8 | 65536 bit | SERIAL | EEPROM | I2C | 5 ms | 5.5 V | 1.7 V | 2 mm | 3 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24VL024H/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 8 | 85 °C | -20 °C | PLASTIC/EPOXY | HVSON | SOLCC8,.11,20 | RECTANGULAR | 小概要 | 1.8 V | 未说明 | 24VL024H/MNY | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | DFN | 2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8 | 5.41 | 0.1 MHz | 256 words | 256 | e4 | EAR99 | 8542.32.00.51 | DUAL | 无铅 | 未说明 | 1 | 0.5 mm | compliant | R-PDSO-N8 | 不合格 | 1.8/3.3 V | OTHER | SYNCHRONOUS | 0.003 mA | 256X8 | 0.8 mm | 8 | 0.000001 A | 2048 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 3.6 V | 1.5 V | 1010DDDR | 3 mm | 2 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24LC64-I/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 8 | 1 | 8192 words | 8000 | 85 °C | -40 °C | PLASTIC/EPOXY | VSON | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | 5 V | 40 | Compliant | 24LC64-I/MNY | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | DFN | VSON, SOLCC8,.11,20 | 5.36 | 0.4 MHz | e4 | 有 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 85 °C | -40 °C | 8542.32.00.51 | 5 V | DUAL | 无铅 | 260 | 1 | 0.5 mm | compliant | R-PDSO-N8 | 不合格 | 3/5 V | INDUSTRIAL | I2C, Serial | 8 kB | SYNCHRONOUS | 0.003 mA | 900 ns | 8KX8 | 0.8 mm | 8 | 64 kb | 0.000001 A | 65536 bit | 400 kHz | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 5.5 V | 2.5 V | 1010DDDR | 3 mm | 2 mm | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24AA04-I/MNY | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 8 | 512 | 85 °C | -40 °C | PLASTIC/EPOXY | HVSON | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 40 | 24AA04-I/MNY | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | DFN | HVSON, SOLCC8,.11,20 | 5.39 | 0.1 MHz | 1 | 512 words | e4 | 有 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.51 | DUAL | 无铅 | 260 | 1 | 0.5 mm | compliant | R-PDSO-N8 | 不合格 | INDUSTRIAL | SYNCHRONOUS | 0.003 mA | 512X8 | 0.8 mm | 8 | 0.000001 A | 4096 bit | SERIAL | EEPROM | I2C | 5 ms | 200 | HARDWARE | 5.5 V | 1.7 V | NO | 3 mm | 2 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24AA64-I/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 8 | 8192 words | 8000 | 85 °C | -40 °C | PLASTIC/EPOXY | VSON | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | 2.5 V | 40 | 24AA64-I/MNY | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | DFN | VSON, SOLCC8,.11,20 | 5.36 | 0.4 MHz | 1 | e4 | 有 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.51 | DUAL | 无铅 | 260 | 1 | 0.5 mm | compliant | R-PDSO-N8 | 不合格 | 2/5 V | INDUSTRIAL | SYNCHRONOUS | 0.003 mA | 8KX8 | 0.8 mm | 8 | 0.000001 A | 65536 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 5.5 V | 1.7 V | 1010DDDR | 3 mm | 2 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24VL025/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 8 | 256 words | 256 | 85 °C | -20 °C | PLASTIC/EPOXY | HVSON | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 1.8 V | 40 | 24VL025/MNY | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | DFN | 2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8 | 5.6 | 0.4 MHz | 1 | e4 | 有 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.51 | DUAL | 无铅 | 260 | 1 | 0.5 mm | compliant | R-PDSO-N8 | 不合格 | 1.8/3.3 V | OTHER | SYNCHRONOUS | 0.003 mA | 256X8 | 0.8 mm | 8 | 0.000001 A | 2048 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | SOFTWARE | 3.6 V | 1.5 V | 1010DDDR | 3 mm | 2 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24VL014/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 8 | 128 words | 128 | 85 °C | -20 °C | PLASTIC/EPOXY | HVSON | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 1.8 V | 40 | 24VL014/MNY | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | DFN | 2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8 | 5.58 | 0.4 MHz | 1 | e4 | 有 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.32.00.51 | DUAL | 无铅 | 260 | 1 | 0.5 mm | compliant | R-PDSO-N8 | 不合格 | 1.8/3.3 V | OTHER | SYNCHRONOUS | 0.003 mA | 128X8 | 0.8 mm | 8 | 0.000001 A | 1024 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 3.6 V | 1.5 V | 1010DDDR | 3 mm | 2 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24VL024/MNY | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 8 | 0.4 MHz | 1 | 256 words | 256 | 85 °C | -20 °C | PLASTIC/EPOXY | HVSON | SOLCC8,.11,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 1.8 V | 40 | 24VL024/MNY | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | DFN | 2 X 3 MM, 0.75 MM HEIGHT, PLASTIC, TDFN-8 | 5.41 | e4 | 有 | EAR99 | 镍钯金 | 8542.32.00.51 | DUAL | 无铅 | 260 | 1 | 0.5 mm | compliant | R-PDSO-N8 | 不合格 | 1.8/3.3 V | OTHER | SYNCHRONOUS | 0.003 mA | 256X8 | 0.8 mm | 8 | 0.000001 A | 2048 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE/SOFTWARE | 3.6 V | 1.5 V | 1010DDDR | 3 mm | 2 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 25LC080AT-E/MSG | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 8 | 1024 words | 1000 | 125 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 5 V | 40 | 25LC080AT-E/MSG | 有 | 不推荐 | MICROCHIP TECHNOLOGY INC | MSOP | ROHS COMPLIANT, PLASTIC, MSOP-8 | 5.26 | 10 MHz | 1 | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 0.65 mm | compliant | S-PDSO-G8 | 不合格 | 3/5 V | AUTOMOTIVE | SYNCHRONOUS | 0.006 mA | 1KX8 | 1.1 mm | 8 | 0.000005 A | 8192 bit | SERIAL | EEPROM | SPI | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE/SOFTWARE | 5.5 V | 2.5 V | 3 mm | 3 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 25LC160AT-I/MSG | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 8 | 10 MHz | 1 | 2048 words | 2000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 5 V | 40 | 25LC160AT-I/MSG | 有 | 不推荐 | MICROCHIP TECHNOLOGY INC | MSOP | 3 X 3 MM, PLASTIC, MSOP-8 | 5.25 | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 0.65 mm | compliant | S-PDSO-G8 | 不合格 | 3/5 V | INDUSTRIAL | SYNCHRONOUS | 0.006 mA | 2KX8 | 1.1 mm | 8 | 0.000005 A | 16384 bit | SERIAL | EEPROM | SPI | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE/SOFTWARE | 5.5 V | 2.5 V | 3 mm | 3 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 25LC1024T-I/SMG | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 8 | SOP8,.3 | RECTANGULAR | 小概要 | 25LC1024T-I/SMG | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | SOIC | SOP, SOP8,.3 | 5 V | 40 | 5.42 | 20 MHz | 1 | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | e3 | 有 | EAR99 | NOR型号 | Matte Tin (Sn) | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | R-PDSO-G8 | 不合格 | 3/5 V | INDUSTRIAL | SYNCHRONOUS | 0.01 mA | 128KX8 | 2.03 mm | 8 | 0.000001 A | 1048576 bit | SERIAL | FLASH | 2.7 V | SPI | 100000 Write/Erase Cycles | 5 ms | HARDWARE/SOFTWARE | 5.5 V | 2.5 V | 5.28 mm | 5.21 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 25LC080AT-E/SNG | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 8 | 1024 words | 1000 | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | 小概要 | 5 V | 40 | 25LC080AT-E/SNG | 有 | 不推荐 | MICROCHIP TECHNOLOGY INC | SOIC | 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 | 5.23 | 10 MHz | 1 | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | R-PDSO-G8 | 不合格 | 3/5 V | AUTOMOTIVE | SYNCHRONOUS | 0.006 mA | 1KX8 | 1.75 mm | 8 | 0.000005 A | 8192 bit | SERIAL | EEPROM | SPI | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE/SOFTWARE | 5.5 V | 2.5 V | 4.9 mm | 3.91 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 25AA1024-I/SMG | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 8 | 活跃 | MICROCHIP TECHNOLOGY INC | SOIC | SOP, SOP8,.3 | 5.41 | 20 MHz | 2.5 V | 40 | SOP8,.3 | RECTANGULAR | 小概要 | 1 | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | 25AA1024-I/SMG | 有 | e3 | 有 | EAR99 | NOR型号 | Matte Tin (Sn) | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | R-PDSO-G8 | 不合格 | 2/5 V | INDUSTRIAL | SYNCHRONOUS | 0.01 mA | 128KX8 | 2.03 mm | 8 | 0.000001 A | 1048576 bit | SERIAL | FLASH | 1.8 V | SPI | 100000 Write/Erase Cycles | 5 ms | HARDWARE/SOFTWARE | 5.5 V | 1.8 V | 5.28 mm | 5.21 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 24LC16BT-E/MSG | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 8 | 2000 | 125 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 5 V | 40 | 0.4 MHz | 24LC16BT-E/MSG | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | TSSOP | ROHS COMPLIANT, PLASTIC, MO-187, MSOP-8 | 5.13 | 1 | 2048 words | e3 | 有 | EAR99 | Matte Tin (Sn) | 1 MILLION ERASE/WRITE CYCLES | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 0.65 mm | compliant | S-PDSO-G8 | 不合格 | 3/5 V | AUTOMOTIVE | SYNCHRONOUS | 0.003 mA | 2KX8 | 1.1 mm | 8 | 0.000005 A | 16384 bit | SERIAL | EEPROM | I2C | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE | 5.5 V | 2.5 V | 1010MMMR | 3 mm | 3 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 25LC080A-E/STG | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 8 | 1024 words | 1000 | 125 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 5 V | 40 | 25LC080A-E/STG | 有 | 不推荐 | MICROCHIP TECHNOLOGY INC | SOIC | 4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8 | 5.26 | 10 MHz | 1 | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 0.65 mm | compliant | R-PDSO-G8 | 不合格 | 3/5 V | AUTOMOTIVE | SYNCHRONOUS | 0.006 mA | 1KX8 | 1.2 mm | 8 | 0.000005 A | 8192 bit | SERIAL | EEPROM | SPI | 1000000 Write/Erase Cycles | 5 ms | 200 | HARDWARE/SOFTWARE | 5.5 V | 2.5 V | 4.4 mm | 3 mm |
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