N/A

-

表面贴装

0603 (1608 Metric)

0603

KOA Speer Electronics, Inc.

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

RN73R1J

活跃

-55°C ~ 155°C

RN73R

0.063 L x 0.031 W (1.60mm x 0.80mm)

±1%

2

±25ppm/°C

58.3 Ohms

Thin Film

0.1W, 1/10W

2.7V ~ 3.6V

2.4GHz

-

1MB Flash, 256kB ROM, 708kB RAM

72.2Mbps

ATWINC3400

802.11b/g/n, Bluetooth v5.0

18.3dBm

Bluetooth, WiFi

Antenna Not Included, U.FL

-95dBm

I²C, SPI, UART

23.68mA ~ 63.9mA

23.68mA ~ 275mA

16-QAM, 64-QAM, BPSK, CCK, DBPSK, DSSS, DQPSK, GFSK, OFDM, QPSK

Automotive AEC-Q200, Moisture Resistant

0.022 (0.55mm)

AEC-Q200

N/A

-

表面贴装

54-SMD Module

微芯片技术

PIC32MZ1025W104

PCB

+ 85 C

3.6 V

- 40 C

40

3 V

222 mA, 279 mA

CAN, CAN FD, Ethernet, I2C, SPI, SQI, UART, USB 2.0 OTG

73 mA, 88 mA

Microchip

Microchip Technology / Atmel

802.11 b/g/n

Tray

WFI32E01

活跃

-40°C ~ 85°C

Tray

-

Wireless & RF Modules

32 bit

3V ~ 3.6V

200MHz

3 V to 3.6 V

1MB Flash, 256kB SRAM

18.5 dBm, 21.5 dBm,

11 Mb/s, 54 Mb/s

WFI32E01

WiFi模块

802.11b/g/n

20.5dBm

WiFi

PCB Trace

-99dBm

I²C, JTAG, SPI, UART, USB

-

-

-

WiFi Modules - 802.11

N/A

-

表面贴装

36-SMD Module

Chip

Details

802.11 b/g/n, Bluetooth

Tray

ATWINC3400

微芯片技术

活跃

Chip

22.43 mm x 14.73 mm x 2 mm

14 - 15dBm

802.11 b/g/n

+ 85 C

3.6 V

- 40 C

50

802.11b

2.7 V

SMD/SMT

87 mA

SPI, UART

256 mA

Microchip

Microchip Technology / Atmel

-40°C ~ 85°C

Tray

ATWINC3400-MR210xA

介质访问控制网络控制器

Wireless & RF Modules

2.7V ~ 3.6V

2.412 GHz to 2.472 GHz

10 Channel

256 kB

18.3 dBm

1 Mb/s, 2 Mb/s, 5.5 Mb/s, 11 Mb/s, 6 Mb/s, 9 Mb/s, 12 Mb/s, 18 Mb/s, 24 Mb/s, 36 Mb/s, 48 Mb/s, 54 Mb/s

-

多协议模块

802.11b/g/n, Bluetooth v5.0

18.3dBm

Bluetooth, WiFi

Integrated, Chip

-95dBm

I²C, SPI, UART

23.7mA

24mA

16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, DSSS, OFDM, QPSK

能源模块

16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK

多协议模块

N/A

-

表面贴装

SMA-NT

SMA-NT

Formosa Microsemi Co., Ltd.

Tape & Reel (TR)

活跃

RN42

-55°C ~ 150°C

-

3V ~ 3.6V

2.4GHz

-

无

77.8V

1500W (1.5kW)

13.2A

113V

3Mbps

70V

-

1

Bluetooth v2.1 + EDR, Class 2

4dBm

Bluetooth

不包括天线

-86dBm

SPI, UART

-

-

-

N/A

-

Free Hanging (In-Line), Right Angle

33-SMD Module

活跃

18 mm x 12 mm x 2.4 mm

微芯片技术

-90dBm

0dBm

+ 85 C

3.6 V

- 40 C

88

1.9 V

SMD/SMT

10 mA

ADC, GPIO, I2C, SPI, UART

10 mA

Microchip

Microchip Technology / Atmel

Details

Bluetooth Low Energy (BLE)

Tray

BM70

-40°C ~ 85°C (TA)

Bulk

MTA-100

活跃

Receptacle

10

Black

1

锁定坡道

Wireless & RF Modules

内螺纹插座

0.100 (2.54mm)

1.9V ~ 3.6V

Shielded

2.44 GHz

Tin

1.9 V to 3.6 V

24 AWG

--

256kB Flash, 32kB ROM, 24kB SRAM

0 dBm

IDC

8.6Kbps

-

蓝牙模块

Bluetooth 5.0

Discrete or Ribbon Cable

2.402 GHz to 2.48 GHz

0dBm

Bluetooth

Integrated, Chip

- 90 dBm

ADC, GPIO, I²C, PWM, SPI, UART

10mA

10mA

PWM

蓝牙模块

馈通

Bluetooth Modules - 802.15.1

2.4 mm

18 mm

12 mm

80.0µin (2.03µm)

N/A

-

表面贴装

33-SMD Module

微芯片技术

4.2 V

- 20 C

88

3.3 V

UART

- 90 dBm, - 92 dBm

Microchip

Microchip Technology / Atmel

Class 2

Tray

活跃

+ 70 C

-20°C ~ 70°C (TA)

Tray

-

Wireless & RF Modules

3.3V ~ 4.2V

2.44 GHz

3.3 V to 4.2 V

4MB Flash, 320kB ROM, 28kB SRAM

1.5 dBm

1 Mb/s

IS1678SM

蓝牙模块

Bluetooth 5.0

1.5dBm

Bluetooth

Integrated, Chip

-92dBm

UART

37mA

43mA

-

Bluetooth Modules - 802.15.1

N/A

-

表面贴装

36-SMD Module

微芯片技术

Chip

802.11 b/g/n

有

+ 85 C

3. 6 V

- 40 C

50

2.7 V

I2C, SPI, UART

Microchip

Microchip Technology / Atmel

Tray

ATWINC3400

活跃

22.43 mm x 14.73 mm x 2 mm

-40°C ~ 85°C

Tray

ATWINC3400-MR210xA

Wireless & RF Modules

2.7V ~ 3.6V

2.4 GHz

1MB Flash, 256kB ROM, 708kB RAM

18.3 dBm

72.2Mbps

ATWINC3400

多协议模块

802.11b/g/n, Bluetooth v5.0

18.3dBm

Bluetooth, WiFi

Integrated, Chip

-95dBm

I²C, SPI, UART

23.68mA ~ 63.9mA

23.68mA ~ 275mA

16-QAM, 64-QAM, BPSK, CCK, DBPSK, DSSS, DQPSK, GFSK, OFDM, QPSK

多协议模块

N/A

-

表面贴装

35-SMD Module

微芯片技术

Bulk

RN42

最后一次购买

-40°C ~ 85°C

RN42

3V ~ 3.6V

2.4GHz

-

3Mbps

-

Bluetooth v2.1 + EDR, Class 2

4dBm

Bluetooth

PCB Trace

-86dBm

SPI, UART

-

-

-

N/A

-

Free Hanging (In-Line)

43-SMD Module

-

铝合金

Polyphenylene Sulfide (PPS)

-

Amphenol Aerospace Operations

Details

Class 1, Class 2

-

Bulk

Metal

2M801-008

活跃

Copper Alloy

Gold

-90dBm

15dBm

+ 70 C

4.2 V

- 20 C

56

3.2 V

SMD/SMT

UART

Microchip

Microchip Technology / Atmel

Integrated

-65°C ~ 150°C

Tray

2M

Crimp

Plug, Female Sockets

26

橄榄色

-

Threaded

Wireless & RF Modules

3.2V ~ 4.2V

B

Shielded

IP67 - Dust Tight, Waterproof

5A

2.44 GHz

橄榄色镉

10-26

3.2 V to 4.2 V

-

-

15 dBm

-

3Mbps

-

蓝牙模块

Bluetooth 5.0

2.402 GHz to 2.48 GHz

2dBm

Bluetooth

Integrated, Trace

-90dBm

I²S, UART

-

-

8DPSK, DQPSK, GFSK

蓝牙模块

联接螺母

Bluetooth Modules - 802.15.1

2.5 mm

32 mm

15 mm

50.0µin (1.27µm)

-

N/A

-

表面贴装

33-SMD Module

微芯片技术

4.2 V

- 20 C

88

3.3 V

UART

- 90 dBm, - 92 dBm

Microchip

Microchip Technology / Atmel

Class 2

Tray

活跃

+ 70 C

-20°C ~ 70°C (TA)

Tray

-

Wireless & RF Modules

3.3V ~ 4.2V

2.44 GHz

3.3 V to 4.2 V

4MB Flash, 320kB ROM, 28kB SRAM

1.5 dBm

1 Mb/s

IS1678SM

蓝牙模块

Bluetooth 5.0

1.5dBm

Bluetooth

Integrated, Chip

-92dBm

UART

37mA

43mA

-

Bluetooth Modules - 802.15.1

N/A

-

表面贴装

50-SMD Module

微芯片技术

有

+ 85 C

3.3 V

- 40 C

56

3.3 V

PCB 安装

59 mA

GPIO, I2C, SPI, UART, USB

- 90 dBm

49 mA

Microchip

Microchip Technology / Atmel

PCB天线

Class 1, Class 2

Tray

活跃

32 mm x 15 mm x 2.5 mm

-40°C ~ 85°C (TA)

Tray

BM83

USB适配器

Wireless & RF Modules

3.2V ~ 4.2V

Shielded

2.44 GHz

3.3 V

-

11 dBm

3 Mb/s

IS2083BM

蓝牙模块

Bluetooth 5.0

2.402 GHz to 2.48 GHz

11dBm

Bluetooth

PCB Trace

-90dBm

ADC, GPIO, I²C, I²S, JTAG, PWM, SPI, UART, USB

38.5mA ~ 49mA

22mA ~ 59mA

GFSK

蓝牙模块

DPSK, DQSK, GFSK

Bluetooth Modules - 802.15.1

2.5 mm

32 mm

15 mm

N/A

-

表面贴装

35-SMD Module

微芯片技术

Bulk

RN42

最后一次购买

-40°C ~ 85°C

RN42

3V ~ 3.6V

2.4GHz

-

3Mbps

-

Bluetooth v2.1 + EDR, Class 2

4dBm

Bluetooth

PCB Trace

-86dBm

SPI, UART

-

-

-

N/A

-

表面贴装

16-SMD Module

Glenair

零售包装

活跃

+ 85 C

3.6 V

- 40 C

320

1.9 V

SMD/SMT

13 mA

I2C, SPI, UART

- 90 dBm

10 mA

Microchip

Microchip Technology / Atmel

Class 2

-40°C ~ 85°C

Tray

*

Wireless & RF Modules

1.9V ~ 3.6V

2.4 GHz

1.8 V, 3.3 V

-

0 dBm

-

-

蓝牙模块

Bluetooth 4.2 + EDR

2.402 GHz to 2.48 GHz

0dBm

Bluetooth

不包括天线

-90dBm

I²C, SPI, UART

10mA

13mA

-

蓝牙模块

Bluetooth Modules - 802.15.1

N/A

-

Gold

Jam Nut

表面贴装

36-SMD Module

Chip

微芯片技术

22.43 mm x 14.73 mm x 2 mm

Non-Compliant

802.11 b/g/n

+ 85 C

3.6 V

- 40 C

500

802.11b

2.7 V

SMD/SMT

87 mA

SPI, UART

256 mA

Microchip

Microchip Technology / Atmel

Chip

802.11 b/g/n, Bluetooth

ATWINC3400

活跃

-40°C ~ 85°C

Bulk

Crimp

介质访问控制网络控制器

125 °C

-55 °C

Male

Wireless & RF Modules

2.7V ~ 3.6V

Straight

49.63 mm

2.412 GHz to 2.472 GHz

55

Pin

10 Channel

Cadmium

256 kB

18.3 dBm

1 Mb/s, 2 Mb/s, 5.5 Mb/s, 11 Mb/s, 6 Mb/s, 9 Mb/s, 12 Mb/s, 18 Mb/s, 24 Mb/s, 36 Mb/s, 48 Mb/s, 54 Mb/s

-

多协议模块

802.11b/g/n, Bluetooth v5.0

18.3dBm

Bluetooth, WiFi

Integrated, Chip

-95dBm

I²C, SPI, UART

23.7mA

24mA

16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, DSSS, OFDM, QPSK

能源模块

16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK

多协议模块

55.16 mm

无

有

N/A

-

NRND (Last Updated: 2 years ago)

表面贴装

35-SMD Module

微芯片技术

HS35R0100A37D

CE

Hollowshaft

Hollow

Dynapar

有

Bulk

RN41

最后一次购买

-40 to 85 Degrees C

RN41

6 ft Cable

3V ~ 3.6V

2.4GHz

5~26 VDC

Differential

-

3Mbps

-

Bluetooth v2.1 +EDR, Class 1

11.9dBm

Bluetooth

不包括天线

-86dBm

SPI, UART

35mA

65mA

-

5~26 VDC

有

IP67

N/A

-

表面贴装

35-SMD Module

微芯片技术

Bulk

RN42

最后一次购买

-40°C ~ 85°C

RN42

3V ~ 3.6V

2.4GHz

-

3Mbps

-

Bluetooth v2.1 + EDR, Class 2

4dBm

Bluetooth

PCB Trace

-86dBm

SPI, UART

-

-

-

N/A

-

表面贴装

35-SMD Module

微芯片技术

Bulk

RN41

最后一次购买

-40°C ~ 85°C

RN41

3V ~ 3.6V

2.4GHz

-

3Mbps

-

Bluetooth v2.1 +EDR, Class 1

11.9dBm

Bluetooth

不包括天线

-86dBm

SPI, UART

35mA

65mA

-

N/A

-

表面贴装

36-SMD Module

微芯片技术

CSK13-11-12V

Barksdale Control Products

有

无

Tray

ATWINC3400

活跃

-40°C ~ 85°C

ATWINC3400-MR210xA

SPST

2.7V ~ 3.6V

8 A, 4 A, 2 A @ 12 VDC, 24 VDC, 42 VDC

2.4GHz

256kB ROM, 708kB RAM

72.2Mbps

ATWINC3400

802.11b/g/n, Bluetooth v5.0

18.3dBm

Bluetooth, WiFi

Integrated, Chip

-95dBm

I²C, SPI, UART

23.68mA ~ 63.9mA

23.68mA ~ 275mA

16-QAM, 64-QAM, BPSK, CCK, DBPSK, DSSS, DQPSK, GFSK, OFDM, QPSK

90-250 psi

快速连接

N/A

-

8 Weeks

Production (Last Updated: 2 years ago)

YES

56

Glenair

零售包装

活跃

Non-Compliant

HVQCCN,

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

UNSPECIFIED

-20 °C

1.2 V

70 °C

IS2020S-203-TRAY

HVQCCN

SQUARE

Microchip Technology Inc

活跃

MICROCHIP TECHNOLOGY INC

5.06

*

CMOS

QUAD

无铅

1

0.4 mm

compliant

S-XQCC-N56

OTHER

0.9 mm

电信电路

7 mm

7 mm

N/A

-

表面贴装

50-SMD Module

微芯片技术

Bulk

RN52

最后一次购买

-40°C ~ 85°C

RN52

-

2.4GHz

16MB Flash

3Mbps

-

Bluetooth v3.0, Class 2

4dBm

Bluetooth

PCB Trace

-85dBm

AIO, I²S, SPI, UART, USB

-

-

DPSK, DQPSK, GFSK

N/A

-

符合RoHS标准

3 V

3.6 V

94 mA

288 mA

- 40 C

+ 105 C

U.FL

7 mm x 7 mm x 0.85 mm

Bluetooth

802.11b/g/n

3000

Reel

2.4 GHz

N/A

-

符合RoHS标准

3 V

3.6 V

94 mA

288 mA

- 40 C

+ 105 C

U.FL

21.7 mm x 17.3 mm x 2.1 mm

Bluetooth

802.11b/g/n

3000

Reel

2.4 GHz

N/A

-

符合RoHS标准

SPI

1.8 V

3.6 V

- 40 C

+ 85 C

PCB天线

21.7 mm x 14.7 mm x 2.1 mm

WiFi - 802.11 b/g/n

WPA3

20 MHz

3.3 V

N/A

-

1.8 V

3.6 V

- 40 C

+ 85 C

UFL

7 mm x 7 mm x 0.9 mm

416

Bluetooth

802.11 b/g/n

SPI

Tray

2.4 GHz

1.8 V to 3.6 V

N/A

-

符合RoHS标准

3 V

3.6 V

94 mA

288 mA

- 40 C

+ 105 C

U.FL

21.7 mm x 17.3 mm x 2.1 mm

Bluetooth

802.11b/g/n

3000

Reel

2.4 GHz