品牌是'Xilinx' (51)

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

表面安装

终端数量

Date Of Intro

JESD-609代码

端子表面处理

附加功能

HTS代码

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

时间@峰值回流温度-最大值(s)

JESD-30代码

资历状况

温度等级

uPs/uCs/外围ICs类型

座位高度-最大

总线兼容性

长度

宽度

XCZU6CG-1SFVC784I
XCZU6CG-1SFVC784I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

784

Transferred

XILINX INC

FBGA, BGA78428X28,32

4

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA78428X28,32

SQUARE

GRID ARRAY, FINE PITCH

0.876 V

0.825 V

0.85 V

锡银铜

8542.31.00.01

BOTTOM

BALL

250

0.8 mm

unknown

30

S-PBGA-B784

INDUSTRIAL

PROGRAMMABLE SoC

3.32 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

23 mm

23 mm

XCZU6CG-L1SFVC784I
XCZU6CG-L1SFVC784I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

784

Transferred

XILINX INC

FBGA, BGA78428X28,32

4

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA78428X28,32

SQUARE

GRID ARRAY, FINE PITCH

0.742 V

0.698 V

0.72 V

锡银铜

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

8542.31.00.01

BOTTOM

BALL

250

0.8 mm

unknown

30

S-PBGA-B784

INDUSTRIAL

PROGRAMMABLE SoC

3.32 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

23 mm

23 mm

XCZU5EV-3SFVC784I
XCZU5EV-3SFVC784I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

784

2017-02-15

FBGA,

4

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

0.9 V

Transferred

XILINX INC

e1

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

8542.31.00.01

BOTTOM

BALL

250

0.8 mm

compliant

30

S-PBGA-B784

INDUSTRIAL

PROGRAMMABLE SoC

3.32 mm

23 mm

23 mm

XCZU6CG-1FBVB900I
XCZU6CG-1FBVB900I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

900

Transferred

XILINX INC

BGA, BGA900,30X30,40

100 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA900,30X30,40

SQUARE

网格排列

0.876 V

0.825 V

0.85 V

8542.31.00.01

BOTTOM

BALL

1 mm

unknown

S-PBGA-B900

INDUSTRIAL

PROGRAMMABLE SoC

2.88 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

31 mm

31 mm

XCZU11EG-3FFVB1517I
XCZU11EG-3FFVB1517I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

1517

2017-02-15

BGA,

4

100 °C

-40 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

0.9 V

Transferred

XILINX INC

e1

锡银铜

8542.31.00.01

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1517

INDUSTRIAL

PROGRAMMABLE SoC

3.51 mm

40 mm

40 mm

XCZU4EG-3SFVC784I
XCZU4EG-3SFVC784I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

784

2017-02-15

FBGA

PLASTIC/EPOXY

-40 °C

100 °C

4

FBGA,

XILINX INC

Transferred

0.9 V

GRID ARRAY, FINE PITCH

SQUARE

e1

锡银铜

8542.31.00.01

BOTTOM

BALL

250

0.8 mm

compliant

30

S-PBGA-B784

INDUSTRIAL

PROGRAMMABLE SoC

3.32 mm

23 mm

23 mm

XCZU9CG-L1SFVA625I
XCZU9CG-L1SFVA625I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

625

Transferred

XILINX INC

FBGA, BGA625,25X25,32

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

0.742 V

0.698 V

0.72 V

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

8542.31.00.01

BOTTOM

BALL

0.8 mm

unknown

S-PBGA-B625

INDUSTRIAL

PROGRAMMABLE SoC

3.43 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

21 mm

21 mm

XCZU6EG-3FFVB1156I
XCZU6EG-3FFVB1156I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

1156

2017-02-15

BGA,

4

100 °C

-40 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

0.9 V

Transferred

XILINX INC

e1

锡银铜

8542.31.00.01

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1156

INDUSTRIAL

PROGRAMMABLE SoC

3.42 mm

35 mm

35 mm

XCZU19EG-3FFVE1924I
XCZU19EG-3FFVE1924I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

1924

2017-02-15

BGA,

4

100 °C

-40 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

0.9 V

Transferred

XILINX INC

e1

锡银铜

8542.31.00.01

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1924

INDUSTRIAL

PROGRAMMABLE SoC

3.71 mm

45 mm

45 mm

XCZU9CG-1SBVA484E
XCZU9CG-1SBVA484E
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

484

Transferred

XILINX INC

FBGA, BGA484,22X22,32

100 °C

PLASTIC/EPOXY

FBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

0.876 V

0.825 V

0.85 V

8542.31.00.01

BOTTOM

BALL

0.8 mm

unknown

S-PBGA-B484

OTHER

PROGRAMMABLE SoC

2.61 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

19 mm

19 mm

XCZU19EG-3FFVC1760I
XCZU19EG-3FFVC1760I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

1760

2017-02-15

BGA,

4

100 °C

-40 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

0.9 V

Transferred

XILINX INC

e1

锡银铜

8542.31.00.01

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1760

INDUSTRIAL

PROGRAMMABLE SoC

3.71 mm

42.5 mm

42.5 mm

XCZU6CG-1SFVC784E
XCZU6CG-1SFVC784E
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

784

Transferred

XILINX INC

FBGA, BGA78428X28,32

4

100 °C

PLASTIC/EPOXY

FBGA

BGA78428X28,32

SQUARE

GRID ARRAY, FINE PITCH

0.876 V

0.825 V

0.85 V

锡银铜

8542.31.00.01

BOTTOM

BALL

250

0.8 mm

unknown

30

S-PBGA-B784

OTHER

PROGRAMMABLE SoC

3.32 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

23 mm

23 mm

XCZU9CG-2SBVA484I
XCZU9CG-2SBVA484I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

484

Transferred

XILINX INC

FBGA, BGA484,22X22,32

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

0.876 V

0.825 V

0.85 V

8542.31.00.01

BOTTOM

BALL

0.8 mm

unknown

S-PBGA-B484

INDUSTRIAL

PROGRAMMABLE SoC

2.61 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

19 mm

19 mm

XCZU9CG-1SBVA484I
XCZU9CG-1SBVA484I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

484

Transferred

XILINX INC

FBGA, BGA484,22X22,32

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

0.876 V

0.825 V

0.85 V

8542.31.00.01

BOTTOM

BALL

0.8 mm

unknown

S-PBGA-B484

INDUSTRIAL

PROGRAMMABLE SoC

2.61 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

19 mm

19 mm

XQ7Z030-2RF900I
XQ7Z030-2RF900I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

900

BGA

BGA900,30X30,40

SQUARE

网格排列

Transferred

XILINX INC

31 X 31 MM, 1 MM PITCH, BGA-900

PLASTIC/EPOXY

e0

锡铅

8542.31.00.01

BOTTOM

BALL

1 mm

not_compliant

S-PBGA-B900

不合格

PROGRAMMABLE SoC

3.44 mm

31 mm

31 mm

XQ7Z030-1RF900I
XQ7Z030-1RF900I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

900

BGA

BGA900,30X30,40

SQUARE

网格排列

Transferred

XILINX INC

31 X 31 MM, 1 MM PITCH, BGA-900

PLASTIC/EPOXY

e0

锡铅

8542.31.00.01

BOTTOM

BALL

1 mm

not_compliant

S-PBGA-B900

不合格

PROGRAMMABLE SoC

3.44 mm

31 mm

31 mm

XCZU6CG-2SBVA484E
XCZU6CG-2SBVA484E
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

484

Transferred

XILINX INC

FBGA, BGA484,22X22,32

100 °C

PLASTIC/EPOXY

FBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

0.876 V

0.825 V

0.85 V

8542.31.00.01

BOTTOM

BALL

0.8 mm

unknown

S-PBGA-B484

OTHER

PROGRAMMABLE SoC

2.61 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

19 mm

19 mm

XCZU4EV-3SFVC784I
XCZU4EV-3SFVC784I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

784

2017-02-15

FBGA,

0.9 V

GRID ARRAY, FINE PITCH

SQUARE

FBGA

PLASTIC/EPOXY

-40 °C

100 °C

4

Transferred

XILINX INC

e1

锡银铜

8542.31.00.01

BOTTOM

BALL

250

0.8 mm

compliant

30

S-PBGA-B784

INDUSTRIAL

PROGRAMMABLE SoC

3.32 mm

23 mm

23 mm

XCZU7EV-3FBVB900I
XCZU7EV-3FBVB900I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

900

2017-02-15

BGA

SQUARE

网格排列

0.9 V

4

BGA,

XILINX INC

Transferred

100 °C

-40 °C

PLASTIC/EPOXY

e1

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

8542.31.00.01

BOTTOM

BALL

245

1 mm

compliant

30

S-PBGA-B900

INDUSTRIAL

PROGRAMMABLE SoC

2.97 mm

31 mm

31 mm

XCZU3EG-3SFVA625E
XCZU3EG-3SFVA625E
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

625

BGA,

4

100 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

0.9 V

Transferred

XILINX INC

e1

锡银铜

8542.31.00.01

BOTTOM

BALL

compliant

S-PBGA-B625

OTHER

PROGRAMMABLE SoC

XCZU9CG-2SFVC784I
XCZU9CG-2SFVC784I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

784

Transferred

XILINX INC

FBGA, BGA78428X28,32

4

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA78428X28,32

SQUARE

GRID ARRAY, FINE PITCH

0.876 V

0.825 V

0.85 V

锡银铜

8542.31.00.01

BOTTOM

BALL

250

0.8 mm

unknown

30

S-PBGA-B784

INDUSTRIAL

PROGRAMMABLE SoC

3.32 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

23 mm

23 mm

XCZU9CG-L1SFVC784I
XCZU9CG-L1SFVC784I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

784

Transferred

XILINX INC

FBGA, BGA78428X28,32

4

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA78428X28,32

SQUARE

GRID ARRAY, FINE PITCH

0.742 V

0.698 V

0.72 V

锡银铜

ALSO OPERATES AT 0.85V NOMINAL SUPPLY

8542.31.00.01

BOTTOM

BALL

250

0.8 mm

unknown

30

S-PBGA-B784

INDUSTRIAL

PROGRAMMABLE SoC

3.32 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

23 mm

23 mm

XCZU6CG-1SFVA625E
XCZU6CG-1SFVA625E
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

625

0.825 V

0.876 V

GRID ARRAY, FINE PITCH

SQUARE

BGA625,25X25,32

FBGA

PLASTIC/EPOXY

100 °C

FBGA, BGA625,25X25,32

XILINX INC

Transferred

0.85 V

8542.31.00.01

BOTTOM

BALL

0.8 mm

unknown

S-PBGA-B625

OTHER

PROGRAMMABLE SoC

3.43 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

21 mm

21 mm

XCZU6CG-2SFVC784I
XCZU6CG-2SFVC784I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

784

Transferred

XILINX INC

FBGA, BGA78428X28,32

4

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA78428X28,32

SQUARE

GRID ARRAY, FINE PITCH

0.876 V

0.825 V

0.85 V

锡银铜

8542.31.00.01

BOTTOM

BALL

250

0.8 mm

unknown

30

S-PBGA-B784

INDUSTRIAL

PROGRAMMABLE SoC

3.32 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

23 mm

23 mm

XCZU9CG-2SBVA484E
XCZU9CG-2SBVA484E
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

484

Transferred

XILINX INC

FBGA, BGA484,22X22,32

100 °C

PLASTIC/EPOXY

FBGA

BGA484,22X22,32

0.85 V

0.825 V

0.876 V

GRID ARRAY, FINE PITCH

SQUARE

8542.31.00.01

BOTTOM

BALL

0.8 mm

unknown

S-PBGA-B484

OTHER

PROGRAMMABLE SoC

2.61 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

19 mm

19 mm