Xilinx的片上系统（SoC）_正品采购_价格信息

品牌是'Xilinx' (1945)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	工厂交货时间	包装/外壳	表面安装	供应商器件包装		操作温度	包装	已出版	系列	无铅代码	零件状态	湿度敏感性等级(MSL)	终止次数	最高工作温度	最小工作温度	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	电源电压	频率	时间@峰值回流温度-最大值(s)	基本部件号	JESD-30代码	电源电压-最大值(Vsup)	电源电压-最小值(Vsup)	界面	速度	内存大小	uPs/uCs/外围ICs类型	核心处理器	周边设备	连接方式	建筑学	核心架构	主要属性	RoHS状态
XCZU7EG-2FFVF1517I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA			464	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)					8542.31.00.01			未说明			未说明						533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	ROHS3 Compliant
XCZU9CG-L2FFVB1156E	Xilinx Inc.	数据表	538 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA	YES		328	0°C~100°C TJ	Bulk	2016	Zynq® UltraScale+™ MPSoC CG		活跃	4 (72 Hours)				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B1156	0.742V	0.698V		533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 599K+ Logic Cells	ROHS3 Compliant
XCZU5EV-L2FBVB900E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	YES		204	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV		活跃	4 (72 Hours)	900			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B900	0.742V	0.698V		533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 256K+ Logic Cells	ROHS3 Compliant
XCZU5CG-1FBVB900I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA			204	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG		活跃	4 (72 Hours)					8542.31.00.01			未说明			未说明						500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 256K+ Logic Cells	ROHS3 Compliant
XCZU9CG-2FFVC900I	Xilinx Inc.	数据表	415 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA			204	-40°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC CG		活跃	4 (72 Hours)																	533MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 599K+ Logic Cells	ROHS3 Compliant
XCZU17EG-2FFVD1760E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1760-BBGA, FCBGA			308	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG	yes	活跃	4 (72 Hours)					8542.31.00.01			未说明			未说明						533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 926K+ Logic Cells	ROHS3 Compliant
XCZU7EG-1FFVF1517E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA			464	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)					8542.31.00.01			未说明			未说明						500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	ROHS3 Compliant
XCZU7EG-1FFVF1517I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA			464	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)					8542.31.00.01			未说明			未说明						500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	ROHS3 Compliant
XCZU7EG-2FBVB900I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA			204	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)					8542.31.00.01			未说明			未说明						533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	ROHS3 Compliant
XCZU2EG-2SFVC784E	Xilinx Inc.	数据表	87 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA			252	0°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG	yes	活跃	4 (72 Hours)					8542.31.00.01			未说明			未说明						533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	ROHS3 Compliant
XCZU5EV-3FBVB900E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA			204	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV		活跃	4 (72 Hours)					8542.31.00.01			未说明			未说明						600MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 256K+ Logic Cells	ROHS3 Compliant
XCZU19EG-2FFVE1924I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1924-BBGA, FCBGA			668	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)					8542.31.00.01			未说明			未说明						533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells	ROHS3 Compliant
XCZU4EV-L1FBVB900I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	YES		204	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV		活跃	4 (72 Hours)	900			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B900	0.742V	0.698V		500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 192K+ Logic Cells	ROHS3 Compliant
XCZU6CG-L2FFVB1156E	Xilinx Inc.	数据表	36 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA	YES		328	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG		活跃	4 (72 Hours)				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B1156	0.742V	0.698V		533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 469K+ Logic Cells	ROHS3 Compliant
XCZU7EG-L1FBVB900I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	YES		204	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)	900			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B900	0.742V	0.698V		500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	ROHS3 Compliant
XCZU7EV-L1FFVF1517I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA	YES		464	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV		活跃	4 (72 Hours)				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B1517	0.742V	0.698V		500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	ROHS3 Compliant
XCZU17EG-3FFVE1924E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1924-BBGA, FCBGA			668	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)					8542.31.00.01			未说明			未说明						600MHz, 667MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 926K+ Logic Cells	ROHS3 Compliant
XCZU3EG-L1SFVA625I	Xilinx Inc.	数据表	785 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA	YES		180	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)	625			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B625	0.742V	0.698V		500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	ROHS3 Compliant
XC7Z020-1CLG484CES	Xilinx Inc.	数据表	699 In Stock	-	最小起订量: 1 最小包装量: 1		484-LFBGA, CSPBGA		484-CSPBGA (19x19)	130	0°C~85°C TJ	Tray	2010	Zynq®-7000		Obsolete	3 (168 Hours)		85°C	0°C							667MHz		XC7Z020				CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	667MHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	ARM	Artix™-7 FPGA, 85K Logic Cells	符合RoHS标准
XCZU11EG-L2FFVC1760E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1760-BBGA, FCBGA	YES		512	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)				ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B1760	0.742V	0.698V		533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 653K+ Logic Cells	ROHS3 Compliant
XCZU5EG-2FBVB900I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA			204	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)					8542.31.00.01			未说明			未说明						533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 256K+ Logic Cells	ROHS3 Compliant
XCZU5EV-2FBVB900E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA			204	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV	yes	活跃	4 (72 Hours)					8542.31.00.01			未说明			未说明						533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 256K+ Logic Cells	ROHS3 Compliant
XCZU5EV-L1FBVB900I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	YES		204	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV		活跃	4 (72 Hours)	900			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明		R-PBGA-B900	0.742V	0.698V		500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 256K+ Logic Cells	ROHS3 Compliant
XCZU11EG-2FFVB1517E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA			488	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG	yes	活跃	4 (72 Hours)					8542.31.00.01			未说明			未说明						533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		Zynq®UltraScale+™ FPGA, 653K+ Logic Cells	ROHS3 Compliant
XC7Z045-2FBG676CES	Xilinx Inc.	数据表	52 In Stock	-	最小起订量: 1 最小包装量: 1	7 Weeks	676-BBGA, FCBGA		676-FCBGA (27x27)	130	0°C~85°C TJ	Tray	2010	Zynq®-7000		Obsolete	4 (72 Hours)		85°C	0°C							800MHz		XC7Z045				CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	800MHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	ARM	Kintex™-7 FPGA, 350K Logic Cells	符合RoHS标准