AMD AM93L18FMB

表面安装

YES

终端数量

16

Manufacturer Part Number

AM93L18FMB

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Package Description

DFP, FL16,.3

Risk Rank

5.91

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC

Package Code

DFP

Package Equivalence Code

FL16,.3

Package Shape

RECTANGULAR

Package Style

FLATPACK

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

FLAT

端子间距

1.27 mm

Reach合规守则

unknown

JESD-30代码

R-XDFP-F16

资历状况

不合格

温度等级

MILITARY

逻辑IC类型

ENCODER

筛选水平

MIL-STD-883 Class B (Modified)