AMD ELANSC400-33AI

表面安装

YES

终端数量

292

Lead Shape

Ball

PCB changed

292

Package Width

27

Package Length

27

Package Height

1.77

Mounting

表面贴装

Supplier Package

BGA

Standard Package Name

BGA

CECC Qualified

无

Supplier Temperature Grade

Industrial

Maximum Operating Temperature (°C)

95

Minimum Operating Temperature (°C)

-40

Maximum Operating Supply Voltage (V)

3.6

Typical Operating Supply Voltage (V)

3.3

Minimum Operating Supply Voltage (V)

2.7

Special Features

液晶控制器

Real Time Clock

有

Parallel Master Port

无

I2S

0

I2C

0

UART

1

USART

0

No. of Timers

1

Interface Type

UART

Programmability

无

Maximum Expanded Memory Size

64MB

Data Bus Width (bit)

32

Maximum Clock Rate (MHz)

33

Maximum CPU Frequency (MHz)

33

Instruction Set Architecture

RISC

Family Name

Elan

HTS

8542.31.00.01

ECCN (US)

3A991.a.2

Package Description

BGA, BGA292,20X20,50

Package Style

网格排列

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA292,20X20,50

Supply Voltage-Nom

3.3 V

Reflow Temperature-Max (s)

未说明

Supply Voltage-Min

2.7 V

Rohs Code

无

Manufacturer Part Number

ELANSC400-33AI

Clock Frequency-Max

0.032 MHz

Package Code

BGA

Package Shape

SQUARE

Manufacturer

AMD

Part Life Cycle Code

Obsolete

Number of I/O Lines

32

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Supply Voltage-Max

3.6 V

Risk Rank

5.86

Part Package Code

BGA

JESD-609代码

e0

零件状态

Obsolete

端子表面处理

Tin/Lead (Sn/Pb)

HTS代码

8542.31.00.01

子类别

Microprocessors

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

未说明

端子间距

1.27 mm

Reach合规守则

unknown

引脚数量

292

JESD-30代码

S-PBGA-B292

资历状况

不合格

电源

3.3 V

速度

33 MHz

uPs/uCs/外围ICs类型

MICROCONTROLLER

程序存储器类型

ROMLess

位元大小

32

有ADC

NO

DMA 通道

YES

脉宽调制通道

NO

数模转换器通道

NO

座位高度-最大

2.61 mm

地址总线宽度

26

外部数据总线宽度

32

以太网

0

USB

0

只读存储器可编程性

FLASH

SPI,SPI

0

CAN

0

宽度

27 mm

长度

27 mm

RoHS状态

RoHS non-compliant