AMD S71PL032J80BAW070

表面安装

YES

终端数量

56

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Package Description

FBGA, BGA56,8X8,32

Access Time-Max

70 ns

Operating Temperature-Max

85 °C

Operating Temperature-Min

-25 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA56,8X8,32

Package Shape

SQUARE

Package Style

GRID ARRAY, FINE PITCH

Supply Voltage-Nom (Vsup)

3 V

ECCN 代码

EAR99

HTS代码

8542.32.00.71

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B56

资历状况

不合格

温度等级

OTHER

电源电流-最大值

0.07 mA

待机电流-最大值

0.000005 A

内存IC类型

存储器电路

混合内存类型

FLASH+PSRAM