AMD S71WS256NC0BFWAP2

表面安装

YES

终端数量

84

Rohs Code

有

Part Life Cycle Code

活跃

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Package Description

FBGA, BGA84,10X12,32

Access Time-Max

80 ns

Operating Temperature-Max

85 °C

Operating Temperature-Min

-25 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA84,10X12,32

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, FINE PITCH

Supply Voltage-Nom (Vsup)

1.8 V

ECCN 代码

EAR99

HTS代码

8542.32.00.71

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B84

资历状况

不合格

温度等级

OTHER

电源电流-最大值

0.066 mA

待机电流-最大值

0.00004 A

内存IC类型

存储器电路

混合内存类型

FLASH+PSRAM