Avago Technologies PEX8632-BB50BIF

表面安装

YES

终端数量

676

Supply Voltage-Nom

1 V

Supply Voltage-Min

0.95 V

Supply Voltage-Max

1.05 V

Package Style

网格排列

Package Shape

SQUARE

Package Equivalence Code

BGA676,26X26,40

Package Code

BGA

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Clock Frequency-Max

100 MHz

Package Description

BGA, BGA676,26X26

Ihs Manufacturer

AVAGO TECHNOLOGIES INC

Part Life Cycle Code

活跃

Gross weight

0.136 g

Capacitors series

KGM

Case - mm

3216

Case - inch

1206

Mounting

SMD

Kind of capacitor

MLCC

Type of capacitor

ceramic

Operating temperature

-55...125°C

容差

±1%

JESD-609代码

e1

端子表面处理

锡银铜

HTS代码

8542.31.00.01

电容量

3.3nF

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

260

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B676

电介质

C0G (NP0)

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

BUS CONTROLLER, PCI

座位高度-最大

2.48 mm

总线兼容性

I2C

最大数据传输率

0.0125 MBps

饱和电流

3

Operating voltage

100V

驱动接口标准

IEEE 1149.6; IEEE 1149.1

宽度

27 mm

长度

27 mm