CML Innovative Technologies CMX602BD4

表面安装

YES

终端数量

16

Material front ring

Plastic

Type of electric connection

Screw connection

Number of contacts as change-over contact

0

Number of contacts as normally open contact

0

Degree of protection (IP)

IP66

Degree of protection (NEMA)

4X

Number of contacts as normally closed contact

2

Colour front ring

Titanium

With front ring

有

Type of control element

Key

With light source

无

Package Description

SOP,

Package Style

小概要

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

3 V

Reflow Temperature-Max (s)

40

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

CMX602BD4

Package Code

SOP

Package Shape

RECTANGULAR

Manufacturer

CML Microcircuits Plc

Part Life Cycle Code

活跃

Ihs Manufacturer

CML MICROCIRCUITS LTD

Risk Rank

1.69

Part Package Code

SOIC

JESD-609代码

e3

无铅代码

有

端子表面处理

Matte Tin (Sn)

HTS代码

8542.39.00.01

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

峰值回流焊温度（摄氏度）

260

功能数量

1

端子间距

1.27 mm

Reach合规守则

compliant

引脚数量

16

JESD-30代码

R-PDSO-G16

资历状况

不合格

温度等级

INDUSTRIAL

座位高度-最大

2.67 mm

通信IC类型

电话呼叫无识别电路

宽度

7.425 mm

长度

10.26 mm