Cypress Semiconductor 0320F

表面安装

YES

终端数量

20

Manufacturer Part Number

CYPD2103-20FNXIT

Rohs Code

有

Part Life Cycle Code

活跃

Ihs Manufacturer

CYPRESS SEMICONDUCTOR CORP

Package Description

VFBGA,

Risk Rank

1.6

Moisture Sensitivity Levels

3

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

VFBGA

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Supply Voltage-Max

5.5 V

Supply Voltage-Nom

3.3 V

Reflow Temperature-Max (s)

30

Supply Voltage-Min

2.7 V

ECCN 代码

3A991.A.2

HTS代码

8542.31.00.01

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

260

端子间距

0.4 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B20

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

微处理器电路

座位高度-最大

0.55 mm

长度

2.03 mm

宽度

1.63 mm