Cypress Semiconductor AM42DL6404G70IS

表面安装

YES

终端数量

73

Supply Voltage-Nom (Vsup)

3 V

Package Style

GRID ARRAY, FINE PITCH

Package Shape

RECTANGULAR

Package Equivalence Code

BGA73,10X12,32

Package Code

FBGA

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Access Time-Max

70 ns

Risk Rank

5.77

Ihs Manufacturer

CYPRESS SEMICONDUCTOR CORP

Part Life Cycle Code

活跃

Rohs Code

无

Manufacturer Part Number

AM42DL6404G70IS

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B73

资历状况

不合格

电源

3 V

温度等级

INDUSTRIAL

电源电流-最大值

0.045 mA

内存IC类型

存储器电路

混合内存类型

FLASH+SRAM