Freescale Semiconductor MC54HC589J

表面安装

NO

终端数量

16

Mounting hole diameter

12.2 mm

Gross weight

26.85

Transport packaging size/quantity

36*22*30.5/500

Switching scheme

ON-ON, SPDT

Teral type

screw terminalsmin

Minimum number of switching cycles (electrical)

10000

Nominal voltage

250 (125) V

Dielectric strength

1500 (50 Hz, 1 min.) V

Number of contacts in group/ groups (total contacts)

3/ 1 (3S)

Rohs Code

无

Part Life Cycle Code

Obsolete

Package Style

IN-LINE

Package Shape

RECTANGULAR

Package Equivalence Code

DIP16,.3

Package Code

DIP

Package Body Material

CERAMIC

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Package Description

DIP, DIP16,.3

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

深度

51 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T16

资历状况

不合格

电源

2/6 V

Contact resistance

≤50 mOhm

温度等级

MILITARY

Insulation resistance

≥1000 (at Uins.dc=500 V) MOhm

比特数

8

Operating temperature range

-25 … +70 °C

Rated current

10 (15) A

高度

28 mm

宽度

16 mm