Freescale Semiconductor MC671L

表面安装

NO

Body material

plastic

终端数量

14

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Package Description

DIP, DIP14,.3

Operating Temperature-Max

70 °C

Operating Temperature-Min

-30 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP14,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Gross Weight

11.68

Transport packaging size/quantity

42*28*23.5/1500

Noal voltage

30 (AC); 60 (DC) Vmin

Body diameter

14.5 mm

Installation hole size

Ф4 mm

JESD-609代码

e0

Connector type

panel socket Ф4 mm red

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

深度

43.5 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T14

资历状况

不合格

温度等级

OTHER

逻辑IC类型

NAND GATE

施密特触发器

NO