Freescale Semiconductor, Inc. (NXP Semiconductors) MC54HC20J

表面安装

NO

终端数量

14

Risk Rank

5.92

Load Capacitance (CL)

50 pF

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP14,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Prop.

27 ns

Package Description

DIP, DIP14,.3

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Part Life Cycle Code

Obsolete

Rohs Code

无

Manufacturer Part Number

MC54HC20J

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T14

资历状况

不合格

电源

2/6 V

温度等级

MILITARY

逻辑IC类型

NAND GATE

最大 I(ol)

0.004 A

施密特触发器

NO