Integrated Device Technology (IDT) 2309NZ-1HPG8

表面安装

YES

终端数量

16

Manufacturer Part Number

2309NZ-1HPG8

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEGRATED DEVICE TECHNOLOGY INC

Package Description

TSSOP, TSSOP16,.25

Risk Rank

5.73

Moisture Sensitivity Levels

1

Operating Temperature-Max

70 °C

Package Body Material

PLASTIC/EPOXY

Package Code

TSSOP

Package Equivalence Code

TSSOP16,.25

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Prop.

8.7 ns

Supply Voltage-Nom (Vsup)

3.3 V

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn85Pb15)

端子位置

DUAL

终端形式

鸥翼

端子间距

0.635 mm

Reach合规守则

not_compliant

JESD-30代码

R-PDSO-G16

资历状况

不合格

电源

3.3 V

温度等级

COMMERCIAL

最大 I(ol)

0.008 A