Integrated Device Technology (IDT) 79RC32T336-180BCG

表面安装

YES

终端数量

256

Manufacturer Part Number

79RC32T336-180BCG

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEGRATED DEVICE TECHNOLOGY INC

Risk Rank

5.84

Moisture Sensitivity Levels

3

Operating Temperature-Max

70 °C

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA256,16X16,40

Package Shape

SQUARE

Package Style

网格排列

JESD-609代码

e1

端子表面处理

Tin/Silver/Copper (Sn/Ag/Cu)

端子位置

BOTTOM

终端形式

BALL

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B256

资历状况

不合格

电源

2.5,3.3 V

温度等级

COMMERCIAL

速度

180 MHz

uPs/uCs/外围ICs类型

MICROPROCESSOR, RISC

位元大小

32