Integrated Device Technology (IDT) 89H64H16G2ZBBLGI

表面安装

YES

终端数量

1156

Manufacturer Part Number

89H64H16G2ZBBLGI

Rohs Code

有

Part Life Cycle Code

活跃

Ihs Manufacturer

INTEGRATED DEVICE TECHNOLOGY INC

Package Description

BGA, BGA1156,34X34,40

Risk Rank

5.63

Clock Frequency-Max

125 MHz

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA1156,34X34,40

Package Shape

SQUARE

Package Style

网格排列

Supply Voltage-Max

1.1 V

Supply Voltage-Nom

1 V

Reflow Temperature-Max (s)

未说明

Supply Voltage-Min

0.9 V

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

未说明

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B1156

资历状况

不合格

电源

1,2.5/3.3 V

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

BUS CONTROLLER, PCI

座位高度-最大

3.42 mm

总线兼容性

I2C; ISA; PCI; SMBUS; VGA

最大数据传输率

64000 MBps

长度

35 mm

宽度

35 mm