Integrated Device Technology (IDT) CV183-1APAG

表面安装

YES

终端数量

64

Manufacturer Part Number

CV183-1APAG

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEGRATED DEVICE TECHNOLOGY INC

Part Package Code

TSSOP

Package Description

6.10 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-153, TSSOP-64

Risk Rank

5.83

Moisture Sensitivity Levels

1

Operating Temperature-Max

70 °C

Package Body Material

PLASTIC/EPOXY

Package Code

TSSOP

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Supply Voltage-Max

3.465 V

Supply Voltage-Nom

3.3 V

Reflow Temperature-Max (s)

30

Supply Voltage-Min

3.135 V

JESD-609代码

e3

ECCN 代码

EAR99

端子表面处理

Matte Tin (Sn) - annealed

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

鸥翼

峰值回流焊温度（摄氏度）

260

端子间距

0.5 mm

Reach合规守则

unknown

引脚数量

64

JESD-30代码

R-PDSO-G64

资历状况

不合格

温度等级

COMMERCIAL

uPs/uCs/外围ICs类型

CLOCK GENERATOR, PROCESSOR SPECIFIC

座位高度-最大

1.2 mm

主时钟/晶体频率-名

14.31818 MHz

输出时钟频率-最大值

96 MHz

长度

17 mm

宽度

6.1 mm