Integrated Device Technology (IDT) ICSSSTUF32864AHLF-T

表面安装

YES

终端数量

96

Manufacturer Part Number

ICSSSTUF32864AHLF-T

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEGRATED DEVICE TECHNOLOGY INC

Risk Rank

5.84

Supply Voltage-Nom (Vsup)

1.8 V

Package Style

GRID ARRAY, FINE PITCH

Package Shape

RECTANGULAR

Package Equivalence Code

BGA96,6X16,32

Package Code

FBGA

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Max

70 °C

Moisture Sensitivity Levels

3

JESD-609代码

e1

端子表面处理

Tin/Silver/Copper (Sn/Ag/Cu)

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

unknown

JESD-30代码

R-PBGA-B96

资历状况

不合格

电源

1.8 V

温度等级

COMMERCIAL

逻辑IC类型

总线驱动器