Integrated Device Technology Inc IDT74SSTU32D869BKG8

表面安装

YES

终端数量

150

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEGRATED DEVICE TECHNOLOGY INC

Operating Temperature-Max

70 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA150,11X19,25

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, FINE PITCH

Supply Voltage-Nom (Vsup)

1.8 V

HTS代码

8542.39.00.01

端子位置

BOTTOM

终端形式

BALL

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

R-PBGA-B150

资历状况

不合格

温度等级

COMMERCIAL

逻辑IC类型

总线驱动器