Intel BD82HM55SLGZS

包装/外壳

FCBGA-1071

表面安装

YES

终端数量

1071

TDP - Max

3.5 W

Moisture Sensitive

有

Integrated Graphics

带图形

Graphics Output

CRT, DisplayPort, DVI, eDP, HDMI, LVDS, SDVO

PCIe Revision

Revision 2.0

CPU Configuration - Max

1

USB Revision

Revision 2.0

Maximum Operating Temperature

+ 108 C

Number of USB Ports

14

Unit Weight

0.572232 oz

Factory Pack QuantityFactory Pack Quantity

450

Mounting Styles

SMD/SMT

Code Name

Ibex Peak

Part # Aliases

904127

Manufacturer

Intel

Number of SATA Ports

4

Brand

Intel

PCIe Configurations

6 Lanes

Chipset Series

HM55

Number of Displays Supported

2

Embedded Options

Embedded

RoHS

Details

Package Description

BGA, BGA1071(UNSPEC)

Package Style

网格排列

Package Body Material

UNSPECIFIED

Package Equivalence Code

BGA1071(UNSPEC)

Rohs Code

有

Manufacturer Part Number

BD82HM55SLGZS

Package Code

BGA

Package Shape

RECTANGULAR

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Risk Rank

5.83

系列

HM55

包装

MouseReel

类型

PCH

HTS代码

8542.31.00.01

子类别

Chipsets

技术

CMOS

端子位置

UNSPECIFIED

终端形式

UNSPECIFIED

Reach合规守则

compliant

资历状况

不合格

电源

1.05,1.5,1.8,3.3,5 V

uPs/uCs/外围ICs类型

微处理器电路

产品类别

Chipsets

产品

移动芯片组

产品类别

Chipsets

宽度

25 mm

长度

27 mm