Intel INTEL-6311ESB

表面安装

YES

终端数量

1284

Manufacturer Part Number

INTEL-6311ESB

Part Life Cycle Code

活跃

Ihs Manufacturer

INTEL CORP

Package Description

BGA, BGA1284,36X36,40

Risk Rank

5.66

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA1284,36X36,40

Package Shape

SQUARE

Package Style

网格排列

端子位置

BOTTOM

终端形式

BALL

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B1284

资历状况

不合格

电源

1.5,3.3,5 V