Intel INTEL-82Q965

表面安装

YES

终端数量

1226

Package Style

GRID ARRAY, FINE PITCH

Package Shape

SQUARE

Package Equivalence Code

BGA1226,43X43,32

Package Code

FBGA

Package Body Material

PLASTIC/EPOXY

Risk Rank

5.69

Package Description

FBGA, BGA1226,43X43,32

Ihs Manufacturer

INTEL CORP

Part Life Cycle Code

活跃

Manufacturer Part Number

INTEL-82Q965

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B1226

资历状况

不合格

电源

1.25,1.5,1.8,3.3 V