参数名
参数值
参数名
参数值
包装/外壳
TO-263-3
EU RoHS
Compliant
ECCN (US)
EAR99
Automotive
无
PPAP
无
Category
功率MOSFET
Process Technology
HiperFET
Channel Mode
Enhancement
Number of Elements per Chip
1
Maximum Drain Source Voltage (V)
150
Maximum Gate Source Voltage (V)
±20
Maximum Continuous Drain Current (A)
76
Maximum Drain Source Resistance (mOhm)
22@10V
Typical Gate Charge @ Vgs (nC)
97@10V
Typical Gate Charge @ 10V (nC)
97
Typical Input Capacitance @ Vds (pF)
5800@25V
Maximum Power Dissipation (mW)
350000
Typical Fall Time (ns)
14
Typical Rise Time (ns)
19
Typical Turn-Off Delay Time (ns)
25
Typical Turn-On Delay Time (ns)
17
Minimum Operating Temperature (°C)
-55
Maximum Operating Temperature (°C)
175
Mounting
表面贴装
Package Height
4.83(Max)
Package Width
9.4(Max)
Package Length
10.41(Max)
PCB changed
2
Tab
Tab
Standard Package Name
TO-263
Supplier Package
D2PAK
Lead Shape
Gull-wing
Vds - Drain-Source Breakdown Voltage
150 V
Vgs th - Gate-Source Threshold Voltage
2.5 V
Pd - Power Dissipation
350 W
Transistor Polarity
N-Channel
Maximum Operating Temperature
+ 175 C
Vgs - Gate-Source Voltage
- 20 V, + 20 V
Minimum Operating Temperature
- 55 C
Mounting Styles
SMD/SMT
Qg - Gate Charge
97 nC
Rds On - Drain-Source Resistance
22 mOhms
Id - Continuous Drain Current
76 A
包装
卷带
零件状态
活跃
技术
Si
引脚数量
3
配置
Single
通道数量
1 Channel
信道型
N