参数名
参数值
参数名
参数值
包装/外壳
TO-268-3
Supplier Package
TO-268
Tab
Tab
PCB changed
2
Package Length
16.05(Max)
Package Width
14(Max)
Package Height
5.1(Max)
Mounting
表面贴装
Maximum Operating Temperature (°C)
150
Minimum Operating Temperature (°C)
-55
Typical Turn-On Delay Time (ns)
20
Typical Turn-Off Delay Time (ns)
58
Typical Rise Time (ns)
25
Typical Fall Time (ns)
20
Maximum Power Dissipation (mW)
400000
Typical Input Capacitance @ Vds (pF)
3600@25V
Typical Gate Charge @ 10V (nC)
65
Typical Gate Charge @ Vgs (nC)
65@10V
Maximum Drain Source Resistance (MOhm)
230@10V
Maximum Continuous Drain Current (A)
26
Maximum Gate Source Voltage (V)
±30
Maximum Drain Source Voltage (V)
500
Number of Elements per Chip
1
Channel Mode
Enhancement
Category
功率MOSFET
PPAP
无
Automotive
无
SVHC Exceeds Threshold
有
SVHC
有
HTS
8541.29.00.95
ECCN (US)
EAR99
EU RoHS
符合免除
Continuous Drain Current
26(A)
Drain-Source On-Volt
500(V)
Operating Temperature Classification
Military
Package Type
TO-268
Operating Temp Range
-55C to 150C
Gate-Source Voltage (Max)
±30(V)
Number of Elements
1
Rad Hardened
无
Vds - Drain-Source Breakdown Voltage
500 V
Vgs th - Gate-Source Threshold Voltage
5.5 V
Pd - Power Dissipation
400 W
Transistor Polarity
N-Channel
Maximum Operating Temperature
+ 150 C
Vgs - Gate-Source Voltage
- 30 V, + 30 V
Minimum Operating Temperature
- 55 C
Mounting Styles
SMD/SMT
Qg - Gate Charge
65 nC
Rds On - Drain-Source Resistance
230 mOhms
Id - Continuous Drain Current
26 A
系列
IXTT26N50
零件状态
活跃
类型
功率MOSFET
技术
Si
引脚数量
3
极性
N
配置
Single
通道数量
1 Channel
功率耗散
400(W)
信道型
N