参数名
参数值
参数名
参数值
包装/外壳
TO-252-3
Package Height
2.4(Max)
Package Width
6.22(Max)
Package Length
6.73(Max)
PCB changed
2
Tab
Tab
Supplier Package
DPAK
Mounting
表面贴装
Maximum Operating Temperature (°C)
175
Minimum Operating Temperature (°C)
-55
Typical Turn-On Delay Time (ns)
19
Typical Turn-Off Delay Time (ns)
37
Typical Rise Time (ns)
52
Typical Fall Time (ns)
30
Maximum Power Dissipation (mW)
130000
Typical Input Capacitance @ Vds (pF)
1420@25V
Typical Gate Charge @ 10V (nC)
37
Typical Gate Charge @ Vgs (nC)
37@10V
Maximum Drain Source Resistance (mOhm)
13@10V
Maximum Continuous Drain Current (A)
64
Maximum Drain Source Voltage (V)
55
Number of Elements per Chip
1
Channel Mode
Enhancement
Category
功率MOSFET
PPAP
Unknown
Automotive
Unknown
ECCN (US)
EAR99
EU RoHS
Compliant
Typical Turn-Off Delay Time
37 ns
Rds On - Drain-Source Resistance
13 mOhms
Mounting Styles
SMD/SMT
Minimum Operating Temperature
- 55 C
Vgs - Gate-Source Voltage
- 20 V, + 20 V
Maximum Operating Temperature
+ 175 C
Pd - Power Dissipation
130 W
Typical Turn-On Delay Time
19 ns
包装
卷带
零件状态
活跃
类型
TrenchMV
子类别
Discrete Semiconductor Modules
技术
Si
引脚数量
3
配置
Single
上升时间
52 ns
产品类别
Discrete Semiconductor Modules
信道型
N
产品
功率MOSFET模块