参数名
参数值
参数名
参数值
包装/外壳
SMPD-24
EU RoHS
符合免除
HTS
8541.29.00.95
Automotive
无
PPAP
无
Category
功率MOSFET
Process Technology
HiperFET
Channel Mode
Enhancement
Number of Elements per Chip
1
Maximum Drain Source Voltage (V)
300
Maximum Gate Source Voltage (V)
±20
Maximum Gate Threshold Voltage (V)
5
Maximum Continuous Drain Current (A)
102
Maximum Gate Source Leakage Current (nA)
200
Maximum IDSS (uA)
50
Maximum Drain Source Resistance (mOhm)
20@10V
Typical Gate Charge @ Vgs (nC)
376@10V
Typical Gate Charge @ 10V (nC)
376
Typical Input Capacitance @ Vds (pF)
24500@25V
Maximum Power Dissipation (mW)
570000
Typical Fall Time (ns)
23
Typical Rise Time (ns)
68
Typical Turn-Off Delay Time (ns)
90
Typical Turn-On Delay Time (ns)
34
Minimum Operating Temperature (°C)
-55
Maximum Operating Temperature (°C)
150
Mounting
表面贴装
Package Height
5.55(Max)
Package Width
23.25(Max)
Package Length
25.25(Max)
PCB changed
21
Supplier Package
SMPD
Vds - Drain-Source Breakdown Voltage
300 V
Vgs th - Gate-Source Threshold Voltage
3 V
Pd - Power Dissipation
570 W
Transistor Polarity
N-Channel
Maximum Operating Temperature
+ 150 C
Vgs - Gate-Source Voltage
- 20 V, + 20 V
Minimum Operating Temperature
- 55 C
Mounting Styles
SMD/SMT
Qg - Gate Charge
376 nC
Rds On - Drain-Source Resistance
20 mOhms
Id - Continuous Drain Current
102 A
零件状态
活跃
技术
Si
引脚数量
21
配置
Single
通道数量
1 Channel
信道型
N