Microchip A2F060M3E-CSG288

表面安装

YES

终端数量

288

Package Description

TFBGA,

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Supply Voltage-Nom

1.5 V

Supply Voltage-Min

1.425 V

Operating Temperature-Max

85 °C

Manufacturer Part Number

A2F060M3E-CSG288

Package Code

TFBGA

Package Shape

SQUARE

Manufacturer

Microsemi Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICROSEMI CORP

Supply Voltage-Max

1.575 V

Risk Rank

8.46

HTS代码

8542.39.00.01

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B288

温度等级

OTHER

组织结构

1536 CLBS, 60000 GATES

座位高度-最大

1.05 mm

可编程逻辑类型

现场可编程门阵列

逻辑块数量

1536

等效门数

60000

宽度

11 mm

长度

11 mm