Microchip A3P400-FGG484

表面安装

YES

终端数量

484

Manufacturer Part Number

A3P400-FGG484

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICROSEMI CORP

Package Description

BGA,

Risk Rank

7.56

Clock Frequency-Max

350 MHz

Moisture Sensitivity Levels

3

Operating Temperature-Max

85 °C

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Shape

SQUARE

Package Style

网格排列

Supply Voltage-Max

1.575 V

Supply Voltage-Nom

1.5 V

Reflow Temperature-Max (s)

40

Family Name

ProASIC®3

Operating Temperature (Max.)

85C

Operating Temperature Classification

Commercial

Package Type

FBGA

Device System Gates

400000

Operating Temp Range

0C to 85C

# I/Os (Max)

194

Number of Usable Gates

400000

Process Technology

130NM

Operating Supply Voltage (Max)

1.575(V)

Operating Supply Voltage (Typ)

1.5(V)

Rad Hardened

无

Operating Supply Voltage (Min)

1.425(V)

Operating Temperature (Min.)

0C

Programmable

有

# Registers

9216

Mounting

表面贴装

Supply Voltage-Min

1.425 V

包装

Tray

JESD-609代码

e1

端子表面处理

Tin/Silver/Copper (Sn/Ag/Cu)

HTS代码

8542.39.00.01

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

250

端子间距

1 mm

Reach合规守则

compliant

频率

231(MHz)

引脚数量

484

JESD-30代码

S-PBGA-B484

资历状况

不合格

温度等级

COMMERCIAL

组织结构

9216 CLBS, 400000 GATES

座位高度-最大

2.44 mm

可编程逻辑类型

现场可编程门阵列

逻辑块数量

9216

等效门数

400000

长度

23 mm

宽度

23 mm