Microchip BM57SPP03MC2-000401

安装类型

表面贴装

包装/外壳

32-SMD Module

供应商器件包装

-

Number of free ISA-slots

0

Supporting protocol for ASI

无

With floppy disc drive

无

Supporting protocol for Data-Highway

无

Supporting protocol for SERCOS

无

Number of HW-interfaces serial TTY

0

Number of HW-interfaces Wireless

0

Supporting protocol for INTERBUS-Safety

无

Radio standard Wi-Fi 802.11

无

Supporting protocol for DeviceNet

无

Supporting protocol for INTERBUS

无

Supporting protocol for LON

无

Number of free PCMCIA-slots

0

Supporting protocol for DeviceNet Safety

无

Supporting protocol for PROFINET CBA

无

Number of free AGP-slots

0

Supporting protocol for PROFIsafe

无

Suitable for safety functions

无

Supporting protocol for KNX

无

Supporting protocol for SafetyBUS p

无

Supporting protocol for CAN

无

Radio standard UMTS

无

Front built-in possible

无

Radio standard GSM

无

Supporting protocol for MODBUS

无

Supporting protocol for Foundation Fieldbus

无

Supporting protocol for SUCONET

无

Supporting protocol for AS-Interface Safety at Work

无

Max. main memory

64000000000

Radio standard Bluetooth

无

IO link master

无

Radio standard GPRS

无

Package

Tray

厂商

微芯片技术

Product Status

Obsolete

操作温度

-

系列

-

类型

TxRx + MCU

电压 - 供电

1.8V

深度

0.446

频率

2.4GHz

内存大小

512MB Flash

议定书

Bluetooth v3.0 + EDR

功率 - 输出

-

无线电频率系列/标准

Bluetooth

敏感度

-

数据率（最大）

-

串行接口

I²C

接收电流

-

传输电流

-

调制

4PSK, 8DPSK, GFSK

宽度

0.43

高度

0.177