Microchip MSD30-08

表面安装

NO

二极管元件材料

SILICON

终端数量

5

Vr - Reverse Voltage

800 V

Maximum Operating Temperature

+ 150 C

Minimum Operating Temperature

- 40 C

Factory Pack QuantityFactory Pack Quantity

10

Mounting Styles

螺钉安装

Manufacturer

Microchip

Brand

微芯片技术

RoHS

Details

Package Description

R-XXSS-X5

Package Style

特殊形状

Package Body Material

UNSPECIFIED

Manufacturer Package Code

CASE M1

Operating Temperature-Min

-40 °C

Operating Temperature-Max

150 °C

Manufacturer Part Number

MSD30-08

Package Shape

RECTANGULAR

Number of Elements

6

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICROSEMI CORP

Forward Voltage-Max (VF)

1.6 V

Risk Rank

5.82

ECCN 代码

EAR99

类型

3 Phase Bridge

HTS代码

8541.10.00.80

子类别

Discrete Semiconductor Modules

技术

Si

端子位置

UNSPECIFIED

终端形式

UNSPECIFIED

Reach合规守则

compliant

引脚数量

5

JESD-30代码

R-XXSS-X5

资历状况

不合格

配置

BRIDGE, 6 ELEMENTS

二极管类型

桥式整流二极管

输出电流-最大值

30 A

产品类别

Discrete Semiconductor Modules

相位的数量

3

Rep Pk反向电压-最大值

800 V

最大非代表Pk前进电流

300 A

击穿电压-最小值

800 V

产品

Rectifier Modules

Vf-正向电压

1.6 V

产品类别

Discrete Semiconductor Modules