Microsemi Corporation SG55464Y

表面安装

NO

终端数量

8

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICROSEMI CORP

Package Description

DIP, DIP8,.3

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP8,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Nom

5 V

JESD-609代码

e0

ECCN 代码

EAR99

端子表面处理

Tin/Lead (Sn/Pb)

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

not_compliant

JESD-30代码

R-XDIP-T8

资历状况

不合格

温度等级

MILITARY

输出电流-最大值

0.3 A

驱动程序位数

2