NXP ISP1704AET，118

表面安装

YES

终端数量

36

Package Description

TFBGA,

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Manufacturer Package Code

SOT912-1

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

3.6 V

Supply Voltage-Min

3 V

Operating Temperature-Max

85 °C

Part Package Code

BGA

Risk Rank

5.77

Supply Voltage-Max

4.5 V

Ihs Manufacturer

ST-ERICSSON

Part Life Cycle Code

Obsolete

Manufacturer

ST-Ericsson

Package Shape

SQUARE

Package Code

TFBGA

Clock Frequency-Max

60 MHz

Manufacturer Part Number

ISP1704AET,118

ECCN 代码

3A001.A.3

HTS代码

8542.31.00.01

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

0.5 mm

Reach合规守则

unknown

引脚数量

36

JESD-30代码

S-PBGA-B36

资历状况

不合格

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

BUS CONTROLLER, UNIVERSAL SERIAL BUS

座位高度-最大

1.15 mm

地址总线宽度

8

宽度

3.5 mm

长度

3.5 mm