参数名
参数值
参数名
参数值
表面安装
NO
终端数量
14
ECCN (US)
EAR99
HTS
8542.39.00.01
Logic Family
HCT
Number of Elements per Chip
4
Number of Element Inputs
2-IN
Number of Output Enables per Element
0
Number of Selection Inputs per Element
0
Number of Element Outputs
1
Maximum Propagation Delay Time @ Maximum CL (ns)
[email protected]
Absolute Propagation Delay Time (ns)
29
Process Technology
CMOS
Maximum Low Level Output Current (mA)
5.2
Maximum High Level Output Current (mA)
-4
Minimum Operating Supply Voltage (V)
4.5
Typical Operating Supply Voltage (V)
5
Maximum Operating Supply Voltage (V)
5.5
Maximum Quiescent Current (uA)
2
Propagation Delay Test Condition (pF)
50
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
125
Supplier Package
PDIP
Mounting
通孔
Package Height
3.2(Max)
Package Length
19.5(Max)
Package Width
6.48(Max)
PCB changed
14
Package Description
0.300 INCH, PLASTIC, MO-001, SOT27-1, DIP-14
Package Style
IN-LINE
Load Capacitance (CL)
50 pF
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
DIP14,.3
Operating Temperature-Min
-40 °C
Reflow Temperature-Max (s)
30
Operating Temperature-Max
125 °C
Rohs Code
有
Manufacturer Part Number
74HCT02N
Supply Voltage-Nom (Vsup)
5 V
Package Code
DIP
Package Shape
RECTANGULAR
Manufacturer
恩智浦半导体
Part Life Cycle Code
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
Risk Rank
7.85
Part Package Code
MO-001
Prop.
29 ns
JESD-609代码
e4
无铅代码
有
零件状态
Obsolete
ECCN 代码
EAR99
端子表面处理
Nickel/Palladium/Gold (Ni/Pd/Au)
HTS代码
8542.39.00.01
子类别
Gates
包装方式
批量包装
技术
CMOS
端子位置
DUAL
终端形式
THROUGH-HOLE
峰值回流焊温度(摄氏度)
260
功能数量
4
端子间距
2.54 mm
Reach合规守则
unknown
引脚数量
14
JESD-30代码
R-PDIP-T14
资历状况
不合格
电源电压-最大值(Vsup)
5.5 V
电源
5 V
温度等级
AUTOMOTIVE
电源电压-最小值(Vsup)
4.5 V
家人
HCT
逻辑功能
NOR
输入数量
2
座位高度-最大
4.2 mm
逻辑IC类型
NOR GATE
最大 I(ol)
0.004 A
传播延迟(tpd)
29 ns
施密特触发器
NO
源Url状态检查日期
2013-06-14 00:00:00
宽度
7.62 mm
长度
19.025 mm
RoHS状态
符合RoHS标准