NXP Semiconductors 74HCT174N

底架

通孔

表面安装

NO

引脚数

16

终端数量

16

ECCN (US)

EAR99

HTS

8542.31.00.01

Logic Family

HCT

Number of Channels per Chip

6

Number of Elements per Chip

1

Number of Element Inputs

6

Number of Element Outputs

6

Bus Hold

无

Set/Reset

主复位

Triggering Type

Positive-Edge

Maximum Propagation Delay Time @ Maximum CL (ns)

[email protected]

Absolute Propagation Delay Time (ns)

53

Process Technology

CMOS

Input Signal Type

Single-Ended

Maximum Low Level Output Current (mA)

4

Maximum High Level Output Current (mA)

-4

Minimum Operating Supply Voltage (V)

4.5

Typical Operating Supply Voltage (V)

5

Maximum Operating Supply Voltage (V)

5.5

Maximum Quiescent Current (mA)

0.008

Propagation Delay Test Condition (pF)

50

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

125

Supplier Package

PDIP

Mounting

通孔

Package Height

3.2(Max)

Package Length

19.5(Max)

Package Width

6.48(Max)

PCB changed

16

Clock-Edge Trigger Type

Positive Edge

Number of Elements

1

RoHS

Compliant

Package Description

DIP, DIP16,.3

Package Style

IN-LINE

Load Capacitance (CL)

50 pF

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP16,.3

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

74HCT174N

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Max

24000000 Hz

Risk Rank

4.46

零件状态

Obsolete

最高工作温度

125 °C

最小工作温度

-40 °C

子类别

FF/Latches

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

6

端子间距

2.54 mm

Reach合规守则

unknown

频率

20 MHz

引脚数量

16

JESD-30代码

R-PDIP-T16

资历状况

不合格

工作电源电压

5 V

极性

Non-Inverting

电源

5 V

温度等级

INDUSTRIAL

电路数量

6

最大电源电压

5.5 V

最小电源电压

4.5 V

比特数

6

传播延迟

53 ns

逻辑功能

D-Type Bus Interface

逻辑IC类型

D FLIP-FLOP

最大 I(ol)

0.004 A

最高频率

20 MHz

触发器类型

积极优势

高电平输出电流

-4 mA

输入电容

3.5 pF

低水平输出电流

4 mA

RoHS状态

供应商未确认

达到SVHC

无SVHC

辐射硬化

无

无铅

无铅