NXP Semiconductors BLF7G24L-100

Contact plating

gold-plated

表面安装

YES

Number of pins

52

终端数量

2

晶体管元件材料

SILICON

外壳材料

1

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

2x26

Row pitch

2.54mm

Gross weight

4.3 g

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

FLANGE MOUNT, R-CDFM-F2

Drain Current-Max (ID)

28 A

Operating Temperature-Max

200 °C

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Package Shape

RECTANGULAR

Package Style

FLANGE MOUNT

Operating temperature

-40...163°C

ECCN 代码

EAR99

端子位置

DUAL

终端形式

FLAT

峰值回流焊温度（摄氏度）

未说明

Reach合规守则

unknown

Current rating

1.5A

时间@峰值回流温度-最大值(s)

未说明

引脚数量

2

JESD-30代码

R-CDFM-F2

资历状况

不合格

配置

SINGLE

操作模式

增强型MOSFET

箱体转运

SOURCE

晶体管应用

AMPLIFIER

极性/通道类型

N-CHANNEL

DS 击穿电压-最小值

65 V

场效应管技术

METAL-OXIDE SEMICONDUCTOR

Rated voltage

60V

最高频段

S带

个人资料

beryllium copper

Plating thickness

0.75µm

Flammability rating

UL94V-0