NXP Semiconductors BSH205G2R

表面安装

YES

终端数量

3

晶体管元件材料

SILICON

外壳材料

1

Transport packaging size/quantity

44*33*24/50

Glue

high-adhesion glue

Tape length

33 m

Type of integrated circuit

interface

Kind of integrated circuit

digital isolator

Data transfer rate

150Mbps

Mounting

SMD

Case

SOP8

Insulation voltage

3.75kV

Kind of channel

unidirectional

Gross weight

1 g

Rohs Code

有

Part Life Cycle Code

Transferred

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Package Code

TO-236

Package Description

ROHS COMPLIANT, PLASTIC PACKAGE-3

Manufacturer Package Code

SOT23

Drain Current-Max (ID)

2 A

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Package Style

小概要

Operating temperature

-40...125°C

ECCN 代码

EAR99

类型

Polyimide tape single-sided

颜色

yellow metallic

端子位置

DUAL

终端形式

鸥翼

峰值回流焊温度（摄氏度）

未说明

Reach合规守则

compliant

时间@峰值回流温度-最大值(s)

未说明

引脚数量

3

参考标准

AEC-Q101; IEC-60134

JESD-30代码

R-PDSO-G3

配置

SINGLE WITH BUILT-IN DIODE

Number of channels

2

操作模式

增强型MOSFET

晶体管应用

SWITCHING

Number of inputs

1/1

极性/通道类型

P-CHANNEL

JEDEC-95代码

TO-236AB

漏极-源极导通最大电阻

0.17 Ω

DS 击穿电压-最小值

20 V

场效应管技术

METAL-OXIDE SEMICONDUCTOR

特征

dismantling at a temperature of 260 - 300 °C without a trace

宽度

50 mm

器件厚度

0.05 mm