NXP Semiconductors BUK765R0-100E

表面安装

YES

Contact plating

gold-plated

Number of pins

38

终端数量

2

晶体管元件材料

SILICON

外壳材料

1

Rohs Code

有

Part Life Cycle Code

Transferred

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

SMALL OUTLINE, R-PSSO-G2

Drain Current-Max (ID)

120 A

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Package Style

小概要

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

2x19

Row pitch

2.54mm

Gross weight

3.61 g

Operating temperature

-40...163°C

ECCN 代码

EAR99

端子表面处理

PURE TIN

附加功能

雪崩 额定

HTS代码

8541.29.00.75

端子位置

SINGLE

终端形式

鸥翼

Reach合规守则

unknown

Current rating

1.5A

参考标准

AEC-Q101; IEC-60134

JESD-30代码

R-PSSO-G2

配置

SINGLE WITH BUILT-IN DIODE

操作模式

增强型MOSFET

箱体转运

DRAIN

晶体管应用

SWITCHING

极性/通道类型

N-CHANNEL

漏极-源极导通最大电阻

0.005 Ω

脉冲漏极电流-最大值(IDM)

650 A

DS 击穿电压-最小值

100 V

雪崩能量等级（Eas）

385 mJ

场效应管技术

METAL-OXIDE SEMICONDUCTOR

Rated voltage

60V

个人资料

beryllium copper

饱和电流

1

Plating thickness

0.75µm

Flammability rating

UL94V-0