NXP Semiconductors I74F175AD,602

表面安装

YES

终端数量

16

ECCN (US)

EAR99

Logic Family

F

Number of Channels per Chip

4

Number of Elements per Chip

1

Number of Element Inputs

4

Number of Element Outputs

4

Bus Hold

无

Set/Reset

主复位

Triggering Type

Positive-Edge

Maximum Propagation Delay Time @ Maximum CL (ns)

8.5@5V

Absolute Propagation Delay Time (ns)

11

Process Technology

Bipolar

Input Signal Type

Single-Ended

Maximum Low Level Output Current (mA)

20

Maximum High Level Output Current (mA)

-1

Minimum Operating Supply Voltage (V)

4.5

Typical Operating Supply Voltage (V)

5

Maximum Operating Supply Voltage (V)

5.5

Propagation Delay Test Condition (pF)

50

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Supplier Package

SO

Mounting

表面贴装

Package Height

1.45(Max)

Package Length

10(Max)

Package Width

4(Max)

PCB changed

16

Package Description

SOP,

Package Style

小概要

Load Capacitance (CL)

50 pF

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Reflow Temperature-Max (s)

40

Operating Temperature-Max

85 °C

Manufacturer Part Number

I74F175AD,602

Supply Voltage-Nom (Vsup)

5 V

Package Code

SOP

Package Shape

RECTANGULAR

Manufacturer

恩智浦半导体

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Risk Rank

5.28

Part Package Code

SOIC

包装

Tube

JESD-609代码

e4

无铅代码

有

端子表面处理

镍钯金

HTS代码

8542.39.00.01

技术

TTL

端子位置

DUAL

终端形式

鸥翼

峰值回流焊温度（摄氏度）

260

功能数量

1

端子间距

1.27 mm

Reach合规守则

unknown

引脚数量

16

JESD-30代码

R-PDSO-G16

资历状况

不合格

极性

Inverting/Non-Inverting

电源电压-最大值(Vsup)

5.5 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

4.5 V

比特数

4

家人

F/FAST

逻辑功能

D-Type Bus Interface

座位高度-最大

1.75 mm

输出极性

COMPLEMENTARY

逻辑IC类型

D FLIP-FLOP

触发器类型

积极优势

传播延迟(tpd)

10 ns

电源电流-最大值(ICC)

31 mA

fmax-Min

110 MHz

宽度

3.9 mm

长度

9.9 mm