NXP Semiconductors MPC8271VRMIB

表面安装

YES

终端数量

516

Rohs Code

有

Part Life Cycle Code

活跃

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

BGA, BGA516,26X26,40

Operating Temperature-Max

70 °C

Package Body Material

PLASTIC/EPOXY

Package Code

BGA

Package Equivalence Code

BGA516,26X26,40

Package Shape

SQUARE

Package Style

网格排列

HTS代码

8542.31.00.01

端子位置

BOTTOM

终端形式

BALL

端子间距

1 mm

Reach合规守则

compliant

JESD-30代码

S-PBGA-B516

资历状况

不合格

温度等级

COMMERCIAL