NXP Semiconductors PMBFJ110

表面安装

YES

终端数量

3

晶体管元件材料

SILICON

外壳材料

1

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Package Code

SOT-23

Package Description

SMALL OUTLINE, R-PDSO-G3

Date Of Intro

1991-01-25

Operating Temperature-Max

150 °C

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Package Style

小概要

Type of diode

TVS array

Max. forward impulse current

17A

Peak pulse power dissipation

0.35kW

Semiconductor structure

unidirectional

Mounting

SMD

Case

SOD323

Max. off-state voltage

8V

Features of semiconductor devices

ESD protection

Kind of package

reel,

Manufacturer series

SDxxLC

Gross weight

7.47

Transport packaging size/quantity

36*26*23/1000

Switching scheme

ON-OFF, SPST

Color key/ housing

black/ black

Number of contacts in group/ number of groups (total contacts)

3 (2+1 backlight) / 1 (3P)

Number of switching cycles (electrical)

≥10000

Key shape

rectangular type C (concave)

Mounting hole size

11 x 30 mm

Dielectric strength

1500 (50 Hz, 1 min.) V

Light type

neon point, 250 V

JESD-609代码

e3

无铅代码

有

ECCN 代码

EAR99

端子表面处理

TIN

HTS代码

8541.21.00

电容量

5pF

端子位置

DUAL

终端形式

鸥翼

峰值回流焊温度（摄氏度）

260

深度

37 mm

Reach合规守则

compliant

时间@峰值回流温度-最大值(s)

30

引脚数量

3

JESD-30代码

R-PDSO-G3

资历状况

不合格

Contact resistance

≤35 mOhm

配置

SINGLE

Insulation resistance

≥100 (500 V, 1 min.) MOhm MOhm

Leakage current

2µA

操作模式

DEPLETION MODE

Switch type

KCD3 series key switch with point illumination

晶体管应用

SWITCHING

极性/通道类型

N-CHANNEL

Operating temperature range

-25…+85 °C

Switching voltage

125 / 250 (AC) V

JEDEC-95代码

TO-236AB

漏极-源极导通最大电阻

18 Ω

场效应管技术

JUNCTION

最大耗散功率(Abs)

0.25 W

热敏电阻应用

8.5V

反馈上限-最大值 (Crss)

15 pF

饱和电流

1

高度

31.8 (on the faceplate) mm

宽度

13.7 mm