NXP Semiconductors PMPB13XNE

Contact plating

gold-plated

表面安装

YES

Number of pins

38

终端数量

6

晶体管元件材料

SILICON

外壳材料

1

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

2x19

Row pitch

2.54mm

Gross weight

2.28 g

Rohs Code

有

Part Life Cycle Code

Transferred

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

2 X 2 MM, 0.65 MM HEIGHT, LEADLESS, ULTRA THIN, PLASTIC, DFN2020MD-6, 6 PIN

Drain Current-Max (ID)

8 A

Package Body Material

PLASTIC/EPOXY

Package Shape

SQUARE

Package Style

小概要

Operating temperature

-40...163°C

JESD-609代码

e3

ECCN 代码

EAR99

端子表面处理

TIN

端子位置

DUAL

终端形式

无铅

Reach合规守则

unknown

Current rating

1.5A

参考标准

IEC-60134

JESD-30代码

S-PDSO-N6

配置

SINGLE WITH BUILT-IN DIODE

操作模式

增强型MOSFET

箱体转运

DRAIN

晶体管应用

SWITCHING

极性/通道类型

N-CHANNEL

漏极-源极导通最大电阻

0.016 Ω

脉冲漏极电流-最大值(IDM)

32 A

DS 击穿电压-最小值

30 V

场效应管技术

METAL-OXIDE SEMICONDUCTOR

Rated voltage

60V

个人资料

beryllium copper

饱和电流

1

Plating thickness

0.75µm

Flammability rating

UL94V-0