NXP Semiconductors SA636BS

表面安装

YES

Contact plating

gold-plated

Number of pins

80

终端数量

20

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Package Code

QFN

Package Description

4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT917-1, HVQFN-20

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

VQCCN

Package Equivalence Code

LCC20,.16SQ,20

Package Shape

SQUARE

Package Style

CHIP CARRIER, VERY THIN PROFILE

Supply Voltage-Nom

3 V

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

2x40

Row pitch

2.54mm

Gross weight

4.8 g

Operating temperature

-40...163°C

HTS代码

8542.39.00.01

端子位置

QUAD

终端形式

无铅

峰值回流焊温度（摄氏度）

未说明

功能数量

1

端子间距

0.5 mm

Reach合规守则

compliant

Current rating

1.5A

时间@峰值回流温度-最大值(s)

未说明

引脚数量

20

JESD-30代码

S-PQCC-N20

资历状况

不合格

温度等级

INDUSTRIAL

座位高度-最大

1 mm

通信IC类型

电信电路

Rated voltage

60V

个人资料

beryllium copper

饱和电流

1

长度

4 mm

宽度

4 mm

Plating thickness

0.75µm

Flammability rating

UL94V-0