NXP Semiconductors TDA8034HN/C1

表面安装

YES

Contact plating

gold-plated

Number of pins

96

终端数量

24

Part Life Cycle Code

活跃

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Package Code

QFN

Package Description

HVQCCN,

Operating Temperature-Max

85 °C

Operating Temperature-Min

-25 °C

Package Body Material

PLASTIC/EPOXY

Package Code

HVQCCN

Package Shape

SQUARE

Package Style

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

2x48

Row pitch

2.54mm

Gross weight

4.32 g

Operating temperature

-40...163°C

HTS代码

8542.39.00.01

端子位置

QUAD

终端形式

无铅

功能数量

1

端子间距

0.5 mm

Reach合规守则

unknown

Current rating

1.5A

引脚数量

24

JESD-30代码

S-PQCC-N24

资历状况

不合格

电源电压-最大值(Vsup)

3.6 V

温度等级

OTHER

电源电压-最小值(Vsup)

2.7 V

座位高度-最大

1 mm

消费者集成电路类型

消费电路

Rated voltage

60V

个人资料

beryllium copper

长度

4 mm

宽度

4 mm

Plating thickness

0.254µm

Flammability rating

UL94V-0