NXP Semiconductors TDA8035HN/C1

表面安装

YES

Contact plating

gold-plated

Number of pins

5

终端数量

32

Part Life Cycle Code

活跃

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Package Code

QFN

Package Description

5 X 5 MM, 0.85 MM HEIGHT, PLASTIC, SOT617-7, HVQFN-32

Operating Temperature-Max

85 °C

Operating Temperature-Min

-25 °C

Package Body Material

PLASTIC/EPOXY

Package Code

HVQCCN

Package Shape

SQUARE

Package Style

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Supply Voltage-Nom (Vsup)

3.3 V

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

SMT

Connector pinout layout

1x5

Gross weight

0.3 g

Operating temperature

-40...163°C

JESD-609代码

e4

端子表面处理

镍钯金

HTS代码

8542.39.00.01

端子位置

QUAD

终端形式

无铅

峰值回流焊温度（摄氏度）

260

功能数量

1

端子间距

0.5 mm

Reach合规守则

unknown

Current rating

1.5A

时间@峰值回流温度-最大值(s)

30

引脚数量

32

JESD-30代码

S-PQCC-N32

资历状况

不合格

电源电压-最大值(Vsup)

5.5 V

温度等级

OTHER

电源电压-最小值(Vsup)

2.7 V

模拟 IC - 其他类型

模拟电路

座位高度-最大

1 mm

Rated voltage

60V

个人资料

beryllium copper

饱和电流

1

长度

5 mm

宽度

5 mm

Plating thickness

0.254µm

Flammability rating

UL94V-0