NXP Semiconductors TDA9178T/N1

Contact plating

gold-plated

表面安装

YES

Number of pins

23

终端数量

24

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

1x23

Gross weight

1.33 g

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Package Code

SOIC

Package Description

PLASTIC, SOT-137, SO-24

Operating Temperature-Max

70 °C

Operating Temperature-Min

-10 °C

Package Body Material

PLASTIC/EPOXY

Package Code

SOP

Package Shape

RECTANGULAR

Package Style

小概要

Operating temperature

-40...163°C

JESD-609代码

e0

端子表面处理

锡铅

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

鸥翼

功能数量

1

端子间距

1.27 mm

Reach合规守则

unknown

Current rating

1.5A

引脚数量

24

JESD-30代码

R-PDSO-G24

资历状况

不合格

电源电压-最大值(Vsup)

8.8 V

温度等级

COMMERCIAL

电源电压-最小值(Vsup)

7.2 V

座位高度-最大

2.65 mm

消费者集成电路类型

消费电路

Rated voltage

60V

个人资料

beryllium copper

长度

15.4 mm

宽度

7.5 mm

Plating thickness

0.75µm

Flammability rating

UL94V-0