NXP Semiconductors TJA1027T/20

表面安装

YES

Contact plating

gold-plated

Number of pins

29

终端数量

8

Part Life Cycle Code

活跃

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Package Code

SOIC

Package Description

SOP,

Package Body Material

PLASTIC/EPOXY

Package Code

SOP

Package Shape

RECTANGULAR

Package Style

小概要

Supply Voltage-Nom

12 V

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

1x29

Gross weight

1.39 g

Operating temperature

-40...163°C

ECCN 代码

EAR99

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

鸥翼

峰值回流焊温度（摄氏度）

260

功能数量

1

端子间距

1.27 mm

Reach合规守则

unknown

Current rating

1.5A

时间@峰值回流温度-最大值(s)

30

引脚数量

8

JESD-30代码

R-PDSO-G8

座位高度-最大

1.75 mm

筛选水平

AEC-Q100

通信IC类型

电路接口

Rated voltage

60V

个人资料

beryllium copper

饱和电流

1

长度

4.9 mm

宽度

3.9 mm

Plating thickness

0.254µm

Flammability rating

UL94V-0