NXP Semiconductors UJA1169ATK/3

表面安装

YES

材料

aluminium

终端数量

20

Type of heatsink

extruded

Heatsink shape

round

Colour

black

Material finishing

anodized

Mounting

heat transfer glue,

Internal diameter

60mm

Gross weight

700 g

Rohs Code

有

Part Life Cycle Code

活跃

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

HVSON-20

Package Body Material

PLASTIC/EPOXY

Package Code

HVSON

Package Equivalence Code

SOLCC20,.14,20

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Supply Voltage-Nom

13 V

端子位置

DUAL

终端形式

无铅

功能数量

1

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

R-PDSO-N20

电源电流-最大值

67 mA

数据率

15000 Mbps

座位高度-最大

1 mm

筛选水平

AEC-Q100

通信IC类型

CAN FD TRANSCEIVER

收发器数量

1

第二个连接器加载的位置数

LED

直径

120mm

长度

5.5 mm

宽度

3.5 mm