NXP USA Inc. 74ABT823DB

表面安装

YES

终端数量

24

Package Description

SSOP, SSOP24,.3

Package Style

SMALL OUTLINE, SHRINK PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

SSOP24,.3

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

74ABT823DB

Supply Voltage-Nom (Vsup)

5 V

Package Code

SSOP

Package Shape

RECTANGULAR

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Max

125000000 Hz

Risk Rank

5.7

子类别

FF/Latches

端子位置

DUAL

终端形式

鸥翼

功能数量

9

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G24

资历状况

不合格

电源

5 V

温度等级

INDUSTRIAL

输出特性

3-STATE

逻辑IC类型

D FLIP-FLOP

最大 I(ol)

0.064 A

触发器类型

积极优势